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1. (WO2018044102) CHIP-SCALE PACKAGE LIGHT-EMITTING DIODE

Pub. No.:    WO/2018/044102    International Application No.:    PCT/KR2017/009562
Publication Date: Fri Mar 09 00:59:59 CET 2018 International Filing Date: Fri Sep 01 01:59:59 CEST 2017
IPC: H01L 33/48
H01L 33/10
H01L 33/46
H01L 33/52
H01L 33/02
H01L 33/62
Applicants: SEOUL VIOSYS CO., LTD.
서울바이오시스주식회사
Inventors: OH, Se Hee
오세희
KIM, Jong Kyu
김종규
LEE, Joon Sub
이준섭
Title: CHIP-SCALE PACKAGE LIGHT-EMITTING DIODE
Abstract:
A chip-scale package light-emitting diode is provided. A light-emitting diode according to an embodiment has an opening provided to expose a pad metal layer and spaced from an opening in a lower insulating layer that exposes an ohmic reflecting layer formed on a mesa. Accordingly, it is possible to prevent solder, particularly Sn, from diffusing and contaminating the ohmic reflecting layer.