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1. (WO2018044053) METHOD FOR MANUFACTURING FLEXIBLE PRINTED CIRCUIT BOARD AND FLEXIBLE PRINTED CIRCUIT BOARD MANUFACTURED BY SAME
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Pub. No.: WO/2018/044053 International Application No.: PCT/KR2017/009451
Publication Date: 08.03.2018 International Filing Date: 29.08.2017
IPC:
H05K 3/46 (2006.01) ,H05K 1/02 (2006.01) ,H05K 1/03 (2006.01) ,H05K 3/32 (2006.01) ,H05K 3/42 (2006.01)
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3
Apparatus or processes for manufacturing printed circuits
46
Manufacturing multi-layer circuits
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1
Printed circuits
02
Details
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1
Printed circuits
02
Details
03
Use of materials for the substrate
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3
Apparatus or processes for manufacturing printed circuits
30
Assembling printed circuits with electric components, e.g. with resistor
32
electrically connecting electric components or wires to printed circuits
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3
Apparatus or processes for manufacturing printed circuits
40
Forming printed elements for providing electric connections to or between printed circuits
42
Plated through-holes
Applicants:
주식회사 아모센스 AMOSENSE CO.,LTD [KR/KR]; 충청남도 천안 서북구 직산읍 4산단5길 90, 천안 제4지방산업단지 19-1블럭 Cheonan the forth Local Industrial Complex 19-1 Block, 90, 4sandan 5-gil, Jiksan-eup, Seobuk-gu Cheonan-si Chungcheongnam-do 31040, KR
Inventors:
단성백 DAN, Sung-Baek; KR
Agent:
특허법인 정안 HONESTY & JR PARTNERS INTELLECTUAL PROPERTY LAW GROUP; 서울시 강남 선릉로 615, 5층 5F, 615 Sunreung-ro, Gangnam-gu Seoul 06103, KR
Priority Data:
10-2016-011207031.08.2016KR
10-2016-011207131.08.2016KR
10-2016-011207231.08.2016KR
10-2016-011207331.08.2016KR
10-2016-011207431.08.2016KR
Title (EN) METHOD FOR MANUFACTURING FLEXIBLE PRINTED CIRCUIT BOARD AND FLEXIBLE PRINTED CIRCUIT BOARD MANUFACTURED BY SAME
(FR) PROCÉDÉ DE FABRICATION DE CARTE DE CIRCUIT IMPRIMÉ FLEXIBLE ET CARTE DE CIRCUIT IMPRIMÉ FLEXIBLE FABRIQUÉE PAR LEDIT PROCÉDÉ
(KO) 연성인쇄회로기판 제조 방법 및 이에 의해 제조된 연성인쇄회로기판
Abstract:
(EN) Provided are a method for manufacturing a flexible printed circuit board and a flexible printed circuit board manufactured by same, wherein dielectric loss caused by a high frequency signal is minimized and loss of the high frequency signal is prevented by laminating a base sheet and an adhesion sheet, which have a low dielectric constant, and laminating on the topmost portion and the bottommost portion, a heat resistant sheet having heat resistance. The provided method for manufacturing a flexible printed circuit board includes: a step for preparing a base sheet, a step for preparing an adhesion sheet having a melting temperature less than that of the base sheet, a step for preparing a heat resistant sheet having a melting temperature equal to or greater than that of the adhesion sheet, and a step for forming a laminate by laminating the base sheet, the adhesion sheet, and the heat resistant sheet, and a step for attaching the laminate by heating and pressing the laminate.
(FR) L'invention concerne un procédé de fabrication d'une carte de circuit imprimé flexible et une carte de circuit imprimé flexible fabriquée par ce procédé, la perte diélectrique provoquée par un signal haute fréquence étant minimisée et la perte du signal haute fréquence étant empêchée par stratification d'une feuille de base et d'une feuille d'adhérence, qui ont une faible constante diélectrique, et par stratification sur la partie la plus haute et sur la partie la plus basse, d'une feuille résistante à la chaleur ayant une résistance à la chaleur. Le procédé de fabrication de carte de circuit imprimé flexible selon l'invention comprend : une étape de préparation d'une feuille de base, une étape de préparation d'une feuille d'adhérence ayant une température de fusion inférieure à celle de la feuille de base, une étape de préparation d'une feuille résistante à la chaleur ayant une température de fusion supérieure ou égale à celle de la feuille d'adhérence, et une étape de formation d'un stratifié par stratification de la feuille de base, de la feuille d'adhérence, et de la feuille résistant à la chaleur, et une étape de fixation du stratifié par chauffage et pressage du stratifié.
(KO) 저유전율을 갖는 베이스 시트 및 접착 시트를 적층하고, 최상부 및 최하부에 내열성을 갖는 내열 시트를 적층하여 고주파 신호에 의한 유전 손실을 최소화하고, 고주파 신호의 손실을 방지하도록 한 연성인쇄회로기판 제조 방법 및 이에 의해 제조된 연성인쇄회로기판을 제시한다. 제시된 연성인쇄회로기판 제조 방법은 베이스 시트를 준비하는 단계, 베이스 시트의 용융 온도 미만의 용융 온도를 갖는 접착 시트를 준비하는 단계, 접착 시트의 용융 온도 이상의 용융 온도를 갖는 내열 시트를 준비하는 단계, 베이스 시트, 접착 시트 및 내열 시트를 적층하여 적층체를 형성하는 단계 및 적층체를 가열 가압하여 접착하는 단계를 포함한다.
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Korean (KO)
Filing Language: Korean (KO)