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1. (WO2018044006) THERMOELECTRIC DEVICE AND THERMOELECTRIC MODULE
Latest bibliographic data on file with the International Bureau    Submit observation

Pub. No.: WO/2018/044006 International Application No.: PCT/KR2017/009350
Publication Date: 08.03.2018 International Filing Date: 28.08.2017
IPC:
H01L 35/32 (2006.01) ,H01L 35/02 (2006.01) ,H01L 35/16 (2006.01) ,H01L 35/18 (2006.01)
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
35
Thermoelectric devices comprising a junction of dissimilar materials, i.e. exhibiting Seebeck or Peltier effect with or without other thermoelectric effects or thermomagnetic effects; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
28
operating with Peltier or Seebeck effect only
32
characterised by the structure or configuration of the cell or thermo-couple forming the device
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
35
Thermoelectric devices comprising a junction of dissimilar materials, i.e. exhibiting Seebeck or Peltier effect with or without other thermoelectric effects or thermomagnetic effects; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
02
Details
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
35
Thermoelectric devices comprising a junction of dissimilar materials, i.e. exhibiting Seebeck or Peltier effect with or without other thermoelectric effects or thermomagnetic effects; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
12
Selection of the material for the legs of the junction
14
using inorganic compositions
16
comprising tellurium or selenium or sulfur
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
35
Thermoelectric devices comprising a junction of dissimilar materials, i.e. exhibiting Seebeck or Peltier effect with or without other thermoelectric effects or thermomagnetic effects; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
12
Selection of the material for the legs of the junction
14
using inorganic compositions
18
comprising arsenic or antimony or bismuth
Applicants:
엘지이노텍 주식회사 LG INNOTEK CO., LTD. [KR/KR]; 서울시 중구 후암로 98 98, Huam-ro Jung-gu Seoul 04637, KR
Inventors:
유영삼 YOO, Young Sam; KR
김우철 KIM, Woo Chul; KR
이형의 LEE, Hyung Eui; KR
김종현 KIM, Jong Hyun; KR
박환주 PARK, Hwan Joo; KR
엄유민 EOM, Yoo Min; KR
황준필 KIM, Woo Chul; KR
Agent:
특허법인 다나 DANA PATENT LAW FIRM; 서울시 강남구 역삼로3길 11 광성빌딩 신관4~6층 4~6th Floor, New Wing, Gwangsung Bldg. 11, Yeoksam-ro 3-gil Gangnam-gu Seoul 06242, KR
Priority Data:
10-2016-011349102.09.2016KR
Title (EN) THERMOELECTRIC DEVICE AND THERMOELECTRIC MODULE
(FR) DISPOSITIF THERMOÉLECTRIQUE ET MODULE THERMOÉLECTRIQUE
(KO) 열전 소자 및 열전 모듈
Abstract:
(EN) A thermoelectric device is disclosed. The thermoelectric device comprises: a body part comprising a hollow in which a semiconductor device is disposed; a plurality of connecting parts protruding on the lateral sides of the body part and comprising connecting holes; and a plurality of electrode parts connected to the semiconductor device and extending to the connecting holes of the connecting parts.
(FR) L'invention porte sur un dispositif thermoélectrique. Le dispositif thermoélectrique comprend : une partie de corps comprenant un creux dans lequel est disposé un dispositif semi-conducteur; une pluralité de parties de liaison faisant saillie sur les côtés latéraux de la partie de corps et comprenant des trous de connexion; et une pluralité de parties d'électrode connectées au dispositif à semi-conducteur et s'étendant jusqu'aux trous de connexion des parties de connexion.
(KO) 열전 소자가 개시된다. 상기 열전 소자는 반도체 소자가 배치되는 중공을 포함하는 몸체부; 상기 몸체부의 측면에 돌출 배치되고 연결홀을 포함하는 복수의 연결부; 및 상기 반도체 소자와 연결되고 상기 연결부의 연결홀로 연장 배치된 복수의 전극부를 포함한다.
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Korean (KO)
Filing Language: Korean (KO)