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1. (WO2018043976) SUBSTRATE PROCESSING APPARATUS
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Pub. No.: WO/2018/043976 International Application No.: PCT/KR2017/009107
Publication Date: 08.03.2018 International Filing Date: 22.08.2017
IPC:
H01L 21/027 (2006.01) ,H01L 21/687 (2006.01) ,H01L 21/683 (2006.01)
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21
Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02
Manufacture or treatment of semiconductor devices or of parts thereof
027
Making masks on semiconductor bodies for further photolithographic processing, not provided for in group H01L21/18 or H01L21/34165
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21
Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
67
Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
683
for supporting or gripping
687
using mechanical means, e.g. chucks, clamps or pinches
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21
Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
67
Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
683
for supporting or gripping
Applicants:
JUSUNG ENGINEERING CO., LTD. [KR/KR]; 240, Opo-ro, Opo-eup Gwangju-si Gyeonggi-do 12773, KR
Inventors:
SHIN, Seung Chul; KR
YOO, Jin Hyuk; KR
LEE, Min Su; KR
CHOI, Dong Hwan; KR
Agent:
NURY PATENT LAW FIRM; 4F, 15-5, Teheran-ro 25-gil Gangnam-gu Seoul 06131, KR
Priority Data:
10-2016-011087930.08.2016KR
Title (EN) SUBSTRATE PROCESSING APPARATUS
(FR) APPAREIL DE TRAITEMENT DE SUBSTRAT
Abstract:
(EN) A substrate processing apparatus may include a first disk provided in a chamber and configured to perform a turning motion and to include a plurality of seating holes periodically arranged within a specific radius from a center axis, a plurality of second disks provided in the seating holes, respectively, and configured to perform a revolving and rotating motion in accordance with the turning motion of the first disk, a first rotary connector structure provided between the second disk and the seating hole to allow for a rotating motion of and for an electric connection to the second disk, an electrostatic chuck provided on the second disk and configured to hold a substrate using an electric power supplied through the first rotary connector structure, and a first magnetic gear fixed to the second disk and configured to exert a torque on the second disk, and a second magnetic gear provided in the chamber to be interact with the first magnetic gear but prevented from turning.
(FR) Un appareil de traitement de substrat peut comprendre un premier disque disposé dans une chambre et conçu pour effectuer un mouvement de rotation et pour inclure une pluralité de trous d'assise agencés périodiquement à l'intérieur d'un rayon spécifique à partir d'un axe central, une pluralité de seconds disques disposés dans les trous d'assise, respectivement, et conçus pour effectuer un mouvement rotatif et de rotation en fonction du mouvement de rotation du premier disque, une première structure de connecteur rotatif disposée entre le second disque et le trou d'assise pour permettre un mouvement de rotation du second disque et pour une connexion électrique au second disque, un mandrin électrostatique disposé sur le second disque et conçu pour maintenir un substrat à l'aide d'une énergie électrique fournie à travers la première structure de connecteur rotatif, et un premier engrenage magnétique fixé au second disque et conçu pour exercer un couple sur le second disque, et un second engrenage magnétique disposé dans la chambre pour interagir avec le premier engrenage magnétique mais qui ne peut pas tourner.
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: English (EN)
Filing Language: English (EN)