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1. (WO2018043535) POWER MODULE, POWER MODULE WITH DRIVE CIRCUIT, INDUSTRIAL EQUIPMENT, ELECTRIC AUTOMOBILE AND HYBRID CAR

Pub. No.:    WO/2018/043535    International Application No.:    PCT/JP2017/031085
Publication Date: Fri Mar 09 00:59:59 CET 2018 International Filing Date: Thu Aug 31 01:59:59 CEST 2017
IPC: H01L 25/07
H01L 23/36
H01L 23/473
H01L 25/18
H02M 7/48
Applicants: ROHM CO., LTD.
ローム株式会社
Inventors: IWAHASHI Seita
岩橋 清太
SAITO Masao
濟藤 匡男
Title: POWER MODULE, POWER MODULE WITH DRIVE CIRCUIT, INDUSTRIAL EQUIPMENT, ELECTRIC AUTOMOBILE AND HYBRID CAR
Abstract:
This power module (PM) (10A) is provided with: a first insulating substrate (21D) that is provided with a first conductive layer (24D) on the surface; a first semiconductor device Q1 that is arranged on the first conductive layer (24D) and has a first electrode connected to the first conductive layer (24D); a first signal electrode (1) that is formed on the surface of the first insulating substrate (21D) and is connected to a second electrode of the first semiconductor device Q1; a second signal electrode (2) that is formed on the surface side of the first insulating substrate (21D) and is connected to a third electrode of the first semiconductor device Q1; and an insulating layer (3) that is arranged on the first insulating substrate (21D). The first signal electrode (1) and the second signal electrode (2) are arranged such that the insulating layer (3) is interposed therebetween. A PM (101) with a drive circuit is provided with: a PM (10S) wherein a power semiconductor device is sealed; an upper cooling device (12U) that is arranged on a first sealing surface (10a) of the PM (10S); and a gate driver (180) that drives the PM (10S) and is mounted on a surface (10u) of the upper cooling device (12U), said surface (10u) being on the reverse side of the surface that is in contact with the PM (10S).