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1. (WO2018043505) ADHESIVE COMPOSITION
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Pub. No.: WO/2018/043505 International Application No.: PCT/JP2017/031010
Publication Date: 08.03.2018 International Filing Date: 29.08.2017
IPC:
C09J 9/02 (2006.01) ,C09J 11/04 (2006.01) ,C09J 201/00 (2006.01)
C CHEMISTRY; METALLURGY
09
DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
J
ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
9
Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
02
Electrically-conducting adhesives
C CHEMISTRY; METALLURGY
09
DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
J
ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
11
Features of adhesives not provided for in group C09J9/76
02
Non-macromolecular additives
04
inorganic
C CHEMISTRY; METALLURGY
09
DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
J
ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
201
Adhesives based on unspecified macromolecular compounds
Applicants:
日立化成株式会社 HITACHI CHEMICAL COMPANY, LTD. [JP/JP]; 東京都千代田区丸の内一丁目9番2号 9-2, Marunouchi 1-chome, Chiyoda-ku, Tokyo 1006606, JP
Inventors:
白川 哲之 SHIRAKAWA Tetsuyuki; JP
松本 悟 MATSUMOTO Satoru; JP
淺川 雄介 ASAKAWA Yusuke; JP
熊田 達也 KUMADA Tatsuya; JP
福井 崇洋 FUKUI Takahiro; JP
Agent:
長谷川 芳樹 HASEGAWA Yoshiki; JP
清水 義憲 SHIMIZU Yoshinori; JP
平野 裕之 HIRANO Hiroyuki; JP
Priority Data:
2016-16765530.08.2016JP
PCT/JP2017/00460508.02.2017JP
Title (EN) ADHESIVE COMPOSITION
(FR) COMPOSITION ADHÉSIVE
(JA) 接着剤組成物
Abstract:
(EN) One aspect of the present invention pertains to an adhesive composition for attaching electronic members together, said adhesive composition containing first conductive particles having protrusions capable of penetrating through an oxide coating formed on the surface of an electrode which is an electronic member, and second conductive particles which are conductive particles other than the first conductive particles and each have a non-conductive core body and a conductive layer provided on the core body.
(FR) Un aspect de la présente invention concerne une composition adhésive destinée à fixer ensemble des éléments électroniques, ladite composition adhésive contenant des premières particules conductrices ayant des saillies aptes à pénétrer à travers un revêtement d'oxyde formé sur la surface d'une électrode qui est un élément électronique, et des secondes particules conductrices qui sont des particules conductrices autres que les premières particules conductrices et qui ont chacune un corps de noyau non conducteur et une couche conductrice disposée sur le corps de noyau.
(JA) 本発明の一側面は、電子部材同士の接続に用いられる接着剤組成物であって、電子部材における電極の表面に形成される酸化被膜を貫通可能な突起部を有する導電粒子である第1の導電粒子と、第1の導電粒子以外の導電粒子であって、非導電性の核体及び該核体上に設けられた導電層を有する導電粒子である第2の導電粒子と、を含有する接着剤組成物に関する。
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)