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1. (WO2018043504) POLISHING COMPOSITION AND POLISHING COMPOSITION SET

Pub. No.:    WO/2018/043504    International Application No.:    PCT/JP2017/031008
Publication Date: Fri Mar 09 00:59:59 CET 2018 International Filing Date: Wed Aug 30 01:59:59 CEST 2017
IPC: C09K 3/14
B24B 37/00
H01L 21/304
Applicants: FUJIMI INCORPORATED
株式会社フジミインコーポレーテッド
TOAGOSEI CO.,LTD.
東亞合成株式会社
Inventors: TSUCHIYA, Kohsuke
土屋 公亮
TANSHO, Hisanori
丹所 久典
ICHITSUBO, Taiki
市坪 大輝
ASADA, Maki
浅田 真希
Title: POLISHING COMPOSITION AND POLISHING COMPOSITION SET
Abstract:
Provided is a polishing composition which is effective for reducing surface defects. A polishing composition according to the present invention contains abrasive grains, a water-soluble polymer and a basic compound. The water-soluble polymer contains a polymer A that satisfies both of the conditions (1) and (2) described below. (1) Each molecule contains a vinyl alcohol unit and a non-vinyl alcohol unit. (2) The adsorption parameter as calculated by [(C1 - C2)/C1] × 100 is 5 or more. In the formula, C1 represents the total amount of organic carbon contained in test liquid L1 that contains 0.017% by weight of the polymer A and 0.009% by weight of ammonia; and C2 represents the total amount of organic carbon contained in a supernatant which is obtained by subjecting a test liquid L2 that contains 0.46% by weight of a colloidal silica having a BET diameter of 35 nm, 0.017% by weight of the polymer A and 0.009% by weight of ammonia to centrifugal separation, thereby having the abrasive grains settle out.