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1. (WO2018043391) MASK-INTEGRATED SURFACE PROTECTION TAPE
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Pub. No.: WO/2018/043391 International Application No.: PCT/JP2017/030714
Publication Date: 08.03.2018 International Filing Date: 28.08.2017
IPC:
H01L 21/304 (2006.01) ,B23K 26/38 (2014.01) ,C09J 7/02 (2006.01) ,C09J 201/00 (2006.01) ,H01L 21/301 (2006.01)
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21
Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02
Manufacture or treatment of semiconductor devices or of parts thereof
04
the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer
18
the devices having semiconductor bodies comprising elements of the fourth group of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
30
Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20-H01L21/26142
302
to change the physical characteristics of their surfaces, or to change their shape, e.g. etching, polishing, cutting
304
Mechanical treatment, e.g. grinding, polishing, cutting
B PERFORMING OPERATIONS; TRANSPORTING
23
MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
K
SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
26
Working by laser beam, e.g. welding, cutting, boring
36
Removing material
38
by boring or cutting
C CHEMISTRY; METALLURGY
09
DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
J
ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
7
Adhesives in the form of films or foils
02
on carriers
C CHEMISTRY; METALLURGY
09
DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
J
ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
201
Adhesives based on unspecified macromolecular compounds
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21
Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02
Manufacture or treatment of semiconductor devices or of parts thereof
04
the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer
18
the devices having semiconductor bodies comprising elements of the fourth group of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
30
Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20-H01L21/26142
301
to subdivide a semiconductor body into separate parts, e.g. making partitions
Applicants:
古河電気工業株式会社 FURUKAWA ELECTRIC CO., LTD. [JP/JP]; 東京都千代田区丸の内2丁目2番3号 2-3, Marunouchi 2-chome, Chiyoda-ku, Tokyo 1008322, JP
Inventors:
五島 裕介 GOTO, Yusuke; JP
横井 啓時 YOKOI, Hirotoki; JP
Agent:
飯田 敏三 IIDA, Toshizo; JP
赤羽 修一 AKABA, Shuichi; JP
Priority Data:
2016-16714829.08.2016JP
Title (EN) MASK-INTEGRATED SURFACE PROTECTION TAPE
(FR) BANDE DE PROTECTION DE SURFACE INTÉGRÉE À UN MASQUE
(JA) マスク一体型表面保護テープ
Abstract:
(EN) Provided is a mask-integrated surface protection tape for a plasma dicing scheme. The mask-integrated surface protection tape ensures protection of a semiconductor wafer pattern surface during a back surface polishing step involving a significant decrease in film thickness and excellent removal of a mask material layer from a base material film of the surface protection tape, thus leaving little adhesive deposit and contributing to a decrease in the occurrence of defective chips. Also provided is a mask-integrated surface protection tape that does not require a photolithography process.
(FR) La présente invention concerne une bande de protection de surface intégrée à un masque pour un schéma de découpage en dés par plasma. La bande de protection de surface intégrée à un masque assure la protection d’une surface de motif de tranche de semi-conducteur pendant une étape de polissage de surface arrière de façon à permettre une diminution significative de l’épaisseur de film et une excellente élimination d’une couche de matériau de masque à partir d’un film de matériau de base de la bande de protection de surface, de façon à laisser peu de dépôt d’adhésif et à contribuer à une diminution de l’apparition de puces défectueuses. L’invention concerne en outre une bande de protection de surface intégrée à un masque qui ne nécessite pas un processus de photolithographie.
(JA) プラズマダイシング方式用であって、薄膜化の程度が大きい裏面研削工程での半導体ウェハのパターン面の保護性、表面保護テープの基材フィルムからのマスク材層の剥離性に優れ、糊残りが少なく、不良チップの発生が少ないマスク一体型表面保護テープを提供する。また、フォトリソグラフィプロセス不要のマスク一体型表面保護テープを提供する。
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)