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1. (WO2018043380) MALEIMIDE RESIN MOLD, METHOD FOR MANUFACTURING MALEIMIDE RESIN MOLD, MALEIMIDE RESIN COMPOSITION, AND CURED PRODUCT THEREOF
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Pub. No.: WO/2018/043380 International Application No.: PCT/JP2017/030694
Publication Date: 08.03.2018 International Filing Date: 28.08.2017
IPC:
C08F 22/40 (2006.01) ,C08G 73/00 (2006.01)
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
F
MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
22
Homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a carboxyl radical and containing at least one other carboxyl radical in the molecule; Salts, anhydrides, esters, amides, imides, or nitriles thereof
36
Amides or imides
40
Imides, e.g. cyclic imides
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
G
MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
73
Macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen or carbon, not provided for in groups C08G12/-C08G71/238
Applicants:
日本化薬株式会社 NIPPON KAYAKU KABUSHIKI KAISHA [JP/JP]; 東京都千代田区丸の内二丁目1番1号 1-1, Marunouchi 2-chome, Chiyoda-ku, Tokyo 1000005, JP
Inventors:
遠島 隆行 TOHJIMA Takayuki; JP
中西 政隆 NAKANISHI Masataka; JP
松浦 一貴 MATSUURA Kazuki; JP
Agent:
特許業務法人 信栄特許事務所 SHIN-EI PATENT FIRM, P.C.; 東京都港区西新橋一丁目7番13号 虎ノ門イーストビルディング8階 Toranomon East Bldg. 8F, 7-13, Nishi-Shimbashi 1-chome, Minato-ku, Tokyo 1050003, JP
Priority Data:
2016-16941731.08.2016JP
Title (EN) MALEIMIDE RESIN MOLD, METHOD FOR MANUFACTURING MALEIMIDE RESIN MOLD, MALEIMIDE RESIN COMPOSITION, AND CURED PRODUCT THEREOF
(FR) MOULE DE RÉSINE DE MALÉIMIDE, PROCÉDÉ DE FABRICATION D’UN MOULE DE RÉSINE DE MALÉIMIDE, COMPOSITION DE RÉSINE DE MALÉIMIDE, ET PRODUIT DURCI CORRESPONDANT
(JA) マレイミド樹脂成型体、マレイミド樹脂成型体の製造方法、マレイミド樹脂組成物及びその硬化物
Abstract:
(EN) Provided are a maleimide resin mold, a maleimide resin composition, and a cured product thereof with less environmental exposure which have excellent workability and production efficiency, for example, in highly reliable semiconductor sealing material applications, electric and electronic part insulating material applications, various composite material applications including laminates (printed wiring glass fiber reinforced composite material) and carbon fiber reinforced composite material (CFRP), various adhesive applications, various coating applications, and structural members. The maleimide resin mold includes a maleimide resin and an organic solvent, and is film-shaped or flake-shaped.
(FR) La présente invention concerne un moule de résine de maléimide, une composition de résine de maléimide, et un produit durci correspondant avec moins d’exposition aux intempéries qui présentent d'excellentes aptitude au façonnage et efficacité de production, par exemple, dans les applications hautement fiables de matériau d’étanchéité de semi-conducteur, des applications de matériau isolant de pièces électriques et électroniques, des diverses applications de matériau composite, y compris des stratifiés (matériau composite renforcé de fibres de verre de circuit imprimé) et de matériau composite renforcé de fibres de carbone (CFRP), des diverses applications en tant qu’adhésif, des diverses applications de revêtement, et des éléments structurels. Le moule de résine de maléimide comprend une résine de maléimide et un solvant organique, et prend la forme d’un film ou la forme d’un flocon.
(JA) 高信頼性半導体封止材用途、電気・電子部品絶縁材料用途、及び積層板(プリント配線ガラス繊維強化複合材料)やCFRP(炭素繊維強化複合材料)を始めとする各種複合材料用途、各種接着剤用途、各種塗料用途、構造用部材等に有用な作業性、生産性に優れ、環境暴露の少ないマレイミド樹脂成型体、マレイミド樹脂組成物及びその硬化物に提供する。マレイミド樹脂成型体は、マレイミド樹脂と有機溶剤を含有し、フィルム状またはフレーク状である。
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)