Some content of this application is unavailable at the moment.
If this situation persist, please contact us atFeedback&Contact
1. (WO2018043342) PHOTOSENSITIVE ADHESIVE COMPOSITION
Latest bibliographic data on file with the International Bureau    Submit observation

Pub. No.: WO/2018/043342 International Application No.: PCT/JP2017/030568
Publication Date: 08.03.2018 International Filing Date: 25.08.2017
IPC:
C09J 167/00 (2006.01) ,C08F 290/06 (2006.01) ,C08F 299/02 (2006.01) ,C08G 75/045 (2016.01) ,C09J 11/06 (2006.01) ,C09J 167/07 (2006.01) ,C09J 171/08 (2006.01) ,G03F 7/004 (2006.01) ,G03F 7/027 (2006.01)
C CHEMISTRY; METALLURGY
09
DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
J
ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
167
Adhesives based on polyesters obtained by reactions forming a carboxylic ester link in the main chain; Adhesives based on derivatives of such polymers
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
F
MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
290
Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
02
on to polymers modified by introduction of unsaturated end groups
06
Polymers provided for in subclass C08G52
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
F
MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
299
Macromolecular compounds obtained by interreacting polymers involving only carbon-to-carbon unsaturated bond reactions, in the absence of non-macromolecular monomers
02
from unsaturated polycondensates
[IPC code unknown for C08G 75/045]
C CHEMISTRY; METALLURGY
09
DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
J
ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
11
Features of adhesives not provided for in group C09J9/76
02
Non-macromolecular additives
06
organic
C CHEMISTRY; METALLURGY
09
DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
J
ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
167
Adhesives based on polyesters obtained by reactions forming a carboxylic ester link in the main chain; Adhesives based on derivatives of such polymers
06
Unsaturated polyesters having carbon-to-carbon unsaturation
07
having terminal carbon-to-carbon unsaturated bonds
C CHEMISTRY; METALLURGY
09
DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
J
ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
171
Adhesives based on polyethers obtained by reactions forming an ether link in the main chain; Adhesives based on derivatives of such polymers
08
Polyethers derived from hydroxy compounds or from their metallic derivatives
G PHYSICS
03
PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
F
PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
7
Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
004
Photosensitive materials
04
Chromates
G PHYSICS
03
PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
F
PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
7
Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
004
Photosensitive materials
027
Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
Applicants:
日産化学株式会社 NISSAN CHEMICAL CORPORATION [JP/JP]; 東京都中央区日本橋二丁目5番1号 5-1, Nihonbashi 2-chome, Chuo-ku, Tokyo 1036119, JP
Inventors:
大橋 拓矢 OHASHI, Takuya; JP
榎本 智之 ENOMOTO, Tomoyuki; JP
岸岡 高広 KISHIOKA, Takahiro; JP
Agent:
特許業務法人はなぶさ特許商標事務所 HANABUSA PATENT & TRADEMARK OFFICE; 東京都千代田区神田駿河台3丁目2番地 新御茶ノ水アーバントリニティ Shin-Ochanomizu Urban Trinity, 2, Kandasurugadai 3-chome, Chiyoda-ku, Tokyo 1010062, JP
Priority Data:
2016-16793630.08.2016JP
Title (EN) PHOTOSENSITIVE ADHESIVE COMPOSITION
(FR) COMPOSITION ADHÉSIVE PHOTOSENSIBLE
(JA) 感光性接着剤組成物
Abstract:
(EN) [Problem] To provide a novel photosensitive adhesive composition. [Solution] A photosensitive adhesive composition which comprises components (A), (B), (C), and (D), the component (B) being contained in a higher mass proportion than the component (A). Component (A) is a polymer which has a structural unit represented by formula (1) and has, at a terminal, a structure represented by formula (2); component (B) is a polymer which has a structural unit represented by the formula (1) and has the carboxy or hydroxy group at a terminal; component (C) is a free-radical photopolymerization initiator; and component (D) is a solvent. (In the formulae, X represents a C1-6 alkyl group, a vinyl group, an allyl group, or a glycidyl group; m and n are each independently 0 or 1; Q represents a C1-16 divalent hydrocarbon group; Z represents a C1-4 divalent linking group, the divalent linking group being bonded to the -O- moiety of the formula (1); and R1 represents a hydrogen atom or a methyl group.)
(FR) La présente invention a pour but de fournir une nouvelle composition adhésive photosensible. Pour atteindre ce but, l'invention porte sur une composition adhésive photosensible qui comprend les constituants (A), (B), (C) et (D), la teneur en constituant (B) étant supérieure en proportion en masse à la teneur en constituant (A). Le constituant (A) est un polymère qui possède un motif structural représenté par la formule (1) et une structure terminale représentée par la formule (2) ; le constituant (B) est un polymère qui possède un motif structural représenté par la formule (1) et un groupe carboxy ou hydroxy terminal ; le constituant (C) est un amorceur de photo-polymérisation radicalaire ; le constituant (D) est un solvant. (Dans les formules, X représente un groupe alkyle en C1-6, un groupe vinyle, un groupe allyle ou un groupe glycidyle ; m et n représentent chacun d'une manière indépendante 0 ou 1 ; Q représente un groupe hydrocarboné divalent en C1-16 ; Z représente un groupe de liaison divalent en C1-4, le groupe de liaison divalent étant relié au fragment -O- de la formule (1) ; R1 représente un atome d'hydrogène ou un groupe méthyle.)
(JA) 【課題】 新規な感光性接着剤組成物を提供する。 【解決手段】 下記(A)成分、(B)成分、(C)成分及び(D)成分を含み、前記(B)成分を前記(A)成分よりも質量比でより多く含有する、感光性接着剤組成物。 (A)成分:下記式(1)で表される構造単位を有し、末端に下記式(2)で表される構造を有するポリマー、(B)成分:前記式(1)で表される構造単位を有し、末端に前記カルボキシ基又はヒドロキシ基を有するポリマー、(C)成分:ラジカル型光重合開始剤及び(D)成分:溶剤(これら式中、Xは炭素原子数1乃至6のアルキル基、ビニル基、アリル基又はグリシジル基を表し、m及びnはそれぞれ独立に0又は1を表し、Qは炭素原子数1乃至16の二価の炭化水素基を表し、Zは炭素原子数1乃至4の二価の連結基を表し、該二価の連結基は前記式(1)における-O-基と結合し、Rは水素原子又はメチル基を表す。)
front page image
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)