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1. (WO2018043308) PRESS-FIT TERMINAL AND SUBSTRATE CONNECTOR
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Pub. No.: WO/2018/043308 International Application No.: PCT/JP2017/030434
Publication Date: 08.03.2018 International Filing Date: 25.08.2017
IPC:
H01R 13/03 (2006.01) ,H01R 12/58 (2011.01)
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
R
ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
13
Details of coupling devices of the kinds covered by groups H01R12/7087
02
Contact members
03
characterised by the material, e.g. plating or coating materials
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
R
ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
12
Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards (PCBs), flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
50
Fixed connections
51
for rigid printed circuits or like structures
55
characterised by the terminals
58
terminals for insertion into holes
Applicants:
株式会社オートネットワーク技術研究所 AUTONETWORKS TECHNOLOGIES, LTD. [JP/JP]; 三重県四日市市西末広町1番14号 1-14, Nishisuehiro-cho, Yokkaichi-shi, Mie 5108503, JP
住友電装株式会社 SUMITOMO WIRING SYSTEMS, LTD. [JP/JP]; 三重県四日市市西末広町1番14号 1-14, Nishisuehiro-cho, Yokkaichi-shi, Mie 5108503, JP
住友電気工業株式会社 SUMITOMO ELECTRIC INDUSTRIES, LTD. [JP/JP]; 大阪府大阪市中央区北浜四丁目5番33号 5-33, Kitahama 4-chome, Chuo-ku, Osaka-shi, Osaka 5410041, JP
Inventors:
宗像 照善 Munekata Teruyoshi; JP
Agent:
特許業務法人上野特許事務所 WENO & PARTNERS; 愛知県名古屋市中区栄三丁目21番23号ケイエスイセヤビル8階 KS Iseya Building 8th Floor, 21-23, Sakae 3-chome, Naka-ku, Nagoya-shi, Aichi 4600008, JP
Priority Data:
2016-16986231.08.2016JP
Title (EN) PRESS-FIT TERMINAL AND SUBSTRATE CONNECTOR
(FR) BORNE À AJUSTEMENT PAR PRESSION ET CONNECTEUR DE SUBSTRAT
(JA) プレスフィット端子および基板用コネクタ
Abstract:
(EN) Provided is a press-fit terminal that is capable of compensating for material characteristics of a copper-zinc based alloy, such as low corrosion resistance, while using the copper-zinc based alloy as a base material, and a substrate connector provided with such a press-fit terminal. This press-fit terminal has: a base material 10; and a base material cover layer 11 that covers the surface of the base material 10 and that is made of a metal species different from that of the base material 10, wherein the base material 10 is made of a copper-zinc based alloy in which the zinc content is 35% by mass or less. The base material cover layer 11 can be a nickel cover layer 11a made of nickel or a nickel alloy and having a thickness of less than 1.0 µm, or a copper cover layer 11b having a thickness of 5 µm or more and made of copper or a copper alloy higher in corrosion resistance than the base material 10.
(FR) L'invention concerne une borne à ajustement par pression qui est capable de compenser des caractéristiques de matériau d'un alliage à base de cuivre-zinc, telle qu'une faible résistance à la corrosion, tout en utilisant l'alliage à base de cuivre-zinc comme matériau de base, et un connecteur de substrat pourvu d'une telle borne à ajustement par pression. Cette borne à ajustement par pression comprend : un matériau de base 10; et une couche de revêtement de matériau de base 11 qui recouvre la surface du matériau de base 10 et qui est constituée d'une espèce métallique différente de celle du matériau de base 10, le matériau de base 10 étant constitué d'un alliage à base de cuivre-zinc dans lequel la teneur en zinc est de 35 % en masse ou moins. La couche de revêtement de matériau de base 11 peut être une couche de revêtement en nickel 11a en nickel ou en alliage de nickel et ayant une épaisseur inférieure à 1,0 µm, ou une couche de revêtement en cuivre ayant une épaisseur de 5 µm ou plus et constituée de cuivre ou d'un alliage de cuivre plus résistant à la corrosion que le matériau de base 10.
(JA) 銅-亜鉛系合金を基材として用いながら、耐食性の低さ等、銅-亜鉛系合金の材料特性を補うことができるプレスフィット端子、およびそのようなプレスフィット端子を備えた基板用コネクタを提供すること。 基材10と、基材10と異なる金属種よりなり、基材10の表面を被覆する基材被覆層11と、を有するプレスフィット端子において、基材10が、亜鉛含有量が35質量%以下である銅-亜鉛系合金よりなるプレスフィット端子とする。基材被覆層11は、厚さ1.0μm未満のニッケルまたはニッケル合金よりなるニッケル被覆層11a、あるいは、銅、または基材10よりも耐食性の高い銅合金よりなる、厚さ5μm以上の銅被覆層11bとすることができる。
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)