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1. (WO2018043162) CIRCUIT MODULE AND ELECTRONIC APPARATUS
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Pub. No.: WO/2018/043162 International Application No.: PCT/JP2017/029668
Publication Date: 08.03.2018 International Filing Date: 18.08.2017
IPC:
H01L 23/28 (2006.01) ,H01L 23/12 (2006.01) ,H01L 25/04 (2014.01) ,H01L 25/065 (2006.01) ,H01L 25/07 (2006.01) ,H01L 25/18 (2006.01) ,H05K 1/02 (2006.01) ,H05K 1/18 (2006.01) ,H05K 7/20 (2006.01)
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23
Details of semiconductor or other solid state devices
28
Encapsulation, e.g. encapsulating layers, coatings
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23
Details of semiconductor or other solid state devices
12
Mountings, e.g. non-detachable insulating substrates
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
25
Assemblies consisting of a plurality of individual semiconductor or other solid state devices
03
all the devices being of a type provided for in the same subgroup of groups H01L27/-H01L51/128
04
the devices not having separate containers
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
25
Assemblies consisting of a plurality of individual semiconductor or other solid state devices
03
all the devices being of a type provided for in the same subgroup of groups H01L27/-H01L51/128
04
the devices not having separate containers
065
the devices being of a type provided for in group H01L27/78
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
25
Assemblies consisting of a plurality of individual semiconductor or other solid state devices
03
all the devices being of a type provided for in the same subgroup of groups H01L27/-H01L51/128
04
the devices not having separate containers
07
the devices being of a type provided for in group H01L29/78
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
25
Assemblies consisting of a plurality of individual semiconductor or other solid state devices
18
the devices being of types provided for in two or more different subgroups of the same main group of groups H01L27/-H01L51/160
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1
Printed circuits
02
Details
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1
Printed circuits
18
Printed circuits structurally associated with non-printed electric components
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
7
Constructional details common to different types of electric apparatus
20
Modifications to facilitate cooling, ventilating, or heating
Applicants:
株式会社村田製作所 MURATA MANUFACTURING CO., LTD. [JP/JP]; 京都府長岡京市東神足1丁目10番1号 10-1, Higashikotari 1-chome, Nagaokakyo-shi, Kyoto 6178555, JP
Inventors:
佐藤 和茂 SATO, Kazushige; JP
天知 伸充 AMACHI, Nobumitsu; JP
江下 雄也 ESHITA, Yuya; JP
Agent:
特許業務法人深見特許事務所 FUKAMI PATENT OFFICE, P.C.; 大阪府大阪市北区中之島三丁目2番4号 中之島フェスティバルタワー・ウエスト Nakanoshima Festival Tower West, 2-4, Nakanoshima 3-chome, Kita-ku, Osaka-shi, Osaka 5300005, JP
Priority Data:
2016-16954431.08.2016JP
Title (EN) CIRCUIT MODULE AND ELECTRONIC APPARATUS
(FR) MODULE DE CIRCUIT ET APPAREIL ÉLECTRONIQUE
(JA) 回路モジュールおよび電子機器
Abstract:
(EN) Provided is a circuit module in which heat can be effectively dissipated from an electronic component connected to a substrate. A circuit module (100) is provided with: a substrate (10) including a substrate base (11) and including a first pad electrode (12) and a second pad electrode (13) which are provided on one main surface of the substrate base (11); a first electronic component (21); a first metal column (22); and a first resin member (30). The first electronic component (21) is connected to the first pad electrode (12). One end surface of the first metal column (22) is connected to the second pad electrode (13). The first electronic component (21) and the first metal column (22) are integrally sealed by the first resin member (30) such that the other end surface of the first metal column (22) is exposed. A connection electrode (41) is provided on the other end surface of the first metal column (22). On a surface of the first resin member (30), a metal layer (42) is disposed such that at least a portion thereof overlaps the first electronic component (21) in a plan view.
(FR) L'invention concerne un module de circuit dans lequel la chaleur peut être efficacement dissipée à partir d'un composant électronique connecté à un substrat. Un module de circuit (100) est pourvu : d'un substrat (10) comprenant une base de substrat (11) et comprenant une première électrode de pastille (12) et une seconde électrode de pastille (13) qui sont disposés sur une surface principale de la base de substrat (11); un premier composant électronique (21); une première colonne métallique (22); et un premier élément de résine (30). Le premier composant électronique (21) est connecté à la première électrode de pastille (12). Une surface d'extrémité de la première colonne métallique (22) est reliée à la seconde électrode de pastille (13). Le premier composant électronique (21) et la première colonne métallique (22) sont scellés intégralement par le premier élément de résine (30) de telle sorte que l'autre surface d'extrémité de la première colonne métallique (22) est exposée. Une électrode de connexion (41) est disposée sur l'autre surface d'extrémité de la première colonne métallique (22). Sur une surface du premier élément de résine (30), une couche métallique (42) est disposée de telle sorte qu'au moins une portion de celle-ci chevauche le premier composant électronique (21) dans une vue en plan.
(JA) 基板に接続された電子部品からの熱を効果的に放散できる回路モジュールを提供する。回路モジュール(100)は、基板素体(11)と基板素体(11)の一方主面に設けられた第1のパッド電極(12)および第2のパッド電極(13)とを備えた基板(10)と、第1の電子部品(21)と、第1の金属柱(22)と、第1の樹脂部材(30)とを備える。第1の電子部品(21)と第1のパッド電極(12)とが接続され、第1の金属柱(22)の一方端面と第2のパッド電極(13)とが接続され、第1の電子部品(21)と第1の金属柱(22)とが、第1の金属柱(22)の他方端面が露出するように第1の樹脂部材(30)により一体封止され、第1の金属柱(22)の他方端面には接続電極(41)が設けられている。第1の樹脂部材(30)の表面には、金属層(42)が、平面視で第1の電子部品(21)と少なくとも一部が重なるように配置されている。
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)