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1. (WO2018043129) CIRCUIT MODULE AND METHOD FOR PRODUCING SAME

Pub. No.:    WO/2018/043129    International Application No.:    PCT/JP2017/029439
Publication Date: Fri Mar 09 00:59:59 CET 2018 International Filing Date: Thu Aug 17 01:59:59 CEST 2017
IPC: H01L 25/065
H01L 25/04
H01L 25/07
H01L 25/18
H05K 1/14
H05K 3/28
H05K 3/36
Applicants: MURATA MANUFACTURING CO., LTD.
株式会社村田製作所
Inventors: FUNAKAWA, Shingo
舟川 慎吾
AMACHI, Nobumitsu
天知 伸充
Title: CIRCUIT MODULE AND METHOD FOR PRODUCING SAME
Abstract:
This circuit module (100) is provided with a plate-like substrate (10), a frame-like substrate (20), a first electronic component (17) and a first sealing member (30). A first connection electrode (14) is arranged on the periphery of one main surface (10F) of the plate-like substrate (10). A second connection electrode (24) is arranged on one main surface (20S) of the frame-like substrate (20) in a position corresponding to the first connection electrode (14). The first connection electrode (14) and the second connection electrode (24) are connected to each other via a first connection member (J1). The first electronic component (17) is sealed by means of the first sealing member (30). The first electronic component (17) and the first sealing member (30) are arranged within a cavity (C) that is configured to comprise the main surface (10F) of the plate-like substrate (10) and an inner surface (20I) of the frame-like substrate (20). The first sealing member (30) is arranged at a distance from the inner surface (20I) of the frame-like substrate (20).