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1. (WO2018043094) OPTICAL SEMICONDUCTOR DEVICE AND OPTICAL SEMICONDUCTOR DEVICE PRODUCTION METHOD

Pub. No.:    WO/2018/043094    International Application No.:    PCT/JP2017/029115
Publication Date: Fri Mar 09 00:59:59 CET 2018 International Filing Date: Fri Aug 11 01:59:59 CEST 2017
IPC: H01L 33/52
H01L 23/02
Applicants: NIKKISO CO., LTD.
日機装株式会社
Inventors: ICHINOKURA Hiroyasu
一ノ倉 啓慈
ISHIGURO Hisaonri
石黒 永孝
URA Kenta
浦 健太
Title: OPTICAL SEMICONDUCTOR DEVICE AND OPTICAL SEMICONDUCTOR DEVICE PRODUCTION METHOD
Abstract:
An optical semiconductor device 10 that comprises: a package substrate 30 that has a recess 34 that opens at an upper surface 31; a light-emitting element 20 that is housed in the recess 34; a window member 40 that is arranged to cover the opening of the recess 34; and a seal structure 50 that seals the space between the package substrate 30 and the window member 40. The seal structure 50 has: a frame-shaped first metal layer 51 that is provided on the upper surface 31 of the package substrate 30; a frame-shaped second metal layer 52 that is provided on an inner surface 44 of the window member 40; and a metal joining part 53 that is provided between the first metal layer 51 and the second metal layer 52. The first metal layer 51 and the second metal layer 52 are configured such that the entirety of one of the first metal layer 51 and the second metal layer 52 is located inside the area in which the other is provided.