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|1. (WO2018043035) RESIN COMPOSITION, RESINOUS SHEET, AND SEMICONDUCTOR DEVICE|
|Title:||RESIN COMPOSITION, RESINOUS SHEET, AND SEMICONDUCTOR DEVICE|
A resin composition which comprises a thermally curable component, a thermoplastic resin, a filler, and a triazine compound, wherein the triazine compound is represented by general formula (1). In general formula (1), R1 is a hydrogen atom or an alkyl group, R2 is a hydrogen atom or an alkyl group, and X is a group comprising any group selected from the group consisting of alkyl, phenyl, hydroxyl, alkoxy, and alkoxysilyl groups.