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1. (WO2018043035) RESIN COMPOSITION, RESINOUS SHEET, AND SEMICONDUCTOR DEVICE

Pub. No.:    WO/2018/043035    International Application No.:    PCT/JP2017/028496
Publication Date: Fri Mar 09 00:59:59 CET 2018 International Filing Date: Sat Aug 05 01:59:59 CEST 2017
IPC: C08L 101/00
C08K 3/36
C08K 5/3492
C08L 63/00
C08L 71/08
C09J 7/00
C09J 11/00
C09J 11/06
C09J 163/00
C09J 201/00
H01L 23/29
H01L 23/31
Applicants: LINTEC CORPORATION
リンテック株式会社
Inventors: KARASAWA Yasunori
柄澤 泰紀
Title: RESIN COMPOSITION, RESINOUS SHEET, AND SEMICONDUCTOR DEVICE
Abstract:
A resin composition which comprises a thermally curable component, a thermoplastic resin, a filler, and a triazine compound, wherein the triazine compound is represented by general formula (1). In general formula (1), R1 is a hydrogen atom or an alkyl group, R2 is a hydrogen atom or an alkyl group, and X is a group comprising any group selected from the group consisting of alkyl, phenyl, hydroxyl, alkoxy, and alkoxysilyl groups.