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1. (WO2018042979) METHOD FOR PRODUCING CONDUCTIVE FILM, CONDUCTIVE FILM, TOUCH PANEL SENSOR AND TOUCH PANEL
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Pub. No.: WO/2018/042979 International Application No.: PCT/JP2017/027456
Publication Date: 08.03.2018 International Filing Date: 28.07.2017
IPC:
G06F 3/041 (2006.01) ,B32B 7/02 (2006.01) ,H01B 5/14 (2006.01) ,H01B 13/00 (2006.01)
G PHYSICS
06
COMPUTING; CALCULATING; COUNTING
F
ELECTRIC DIGITAL DATA PROCESSING
3
Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
01
Input arrangements or combined input and output arrangements for interaction between user and computer
03
Arrangements for converting the position or the displacement of a member into a coded form
041
Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
B PERFORMING OPERATIONS; TRANSPORTING
32
LAYERED PRODUCTS
B
LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
7
Layered products characterised by the relation between layers, i.e. products essentially comprising layers having different physical properties or products characterised by the interconnection of layers
02
in respect of physical properties, e.g. hardness
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
B
CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
5
Non-insulated conductors or conductive bodies characterised by their form
14
comprising conductive layers or films on insulating-supports
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
B
CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
13
Apparatus or processes specially adapted for manufacturing conductors or cables
Applicants: FUJIFILM CORPORATION[JP/JP]; 26-30, Nishiazabu 2-chome, Minato-ku, Tokyo 1068620, JP
Inventors: ICHIKI Takahiko; JP
Agent: WATANABE Mochitoshi; JP
MIWA Haruko; JP
ITOH Hideaki; JP
MITSUHASHI Fumio; JP
Priority Data:
2016-17262905.09.2016JP
Title (EN) METHOD FOR PRODUCING CONDUCTIVE FILM, CONDUCTIVE FILM, TOUCH PANEL SENSOR AND TOUCH PANEL
(FR) PROCÉDÉ POUR FABRIQUER UN FILM CONDUCTEUR, FILM CONDUCTEUR, CAPTEUR DE PANNEAU TACTILE ET PANNEAU TACTILE
(JA) 導電性フィルムの製造方法、導電性フィルム、タッチパネルセンサー、及び、タッチパネル
Abstract:
(EN) The present invention addresses the problem of easily producing a conductive film which is provided with a thin metal wire that has a narrow line width, while exhibiting excellent adhesion to a substrate. A method for producing a conductive film according to the present invention sequentially comprises, in the following order: a step for forming a first metal film on at least one main surface of a substrate; a step for forming a second metal film, which contains a main component that is different from the main component of the first metal film, on the first metal film; a step for forming a resist film, which is provided with an opening part having a line width of 2.0 μm or less, in a region on the second metal film, where a thin metal wire is to be formed; a step for forming a third metal film; a step for removing the resist film; a step for removing the second metal film with use of a second etching liquid, while using the third metal film as a mask; and a step for removing the first metal film with use of a first etching liquid, while using the third metal film as a mask.
(FR) La présente invention résout le problème de la production facile d'un film conducteur qui est pourvu d'un fil métallique mince ayant une largeur de ligne étroite, tout en présentant une excellente adhérence à un substrat. Un procédé de production d'un film conducteur selon la présente invention comprend séquentiellement, dans l'ordre suivant : une étape consistant à former un premier film métallique sur au moins une surface principale d'un substrat; une étape consistant à former un second film métallique, qui contient un composant principal différent du composant principal du premier film métallique, sur le premier film métallique; une étape consistant à former un film de réserve, qui est pourvu d'une partie d'ouverture ayant une largeur de ligne inférieure ou égale à 2,0 µm, dans une région sur le second film métallique, où un fil métallique mince doit être formé; une étape consistant à former un troisième film métallique; une étape consistant à retirer le film de réserve; une étape consistant à retirer le second film métallique à l'aide d'un second liquide de gravure, tout en utilisant le troisième film métallique comme masque; et une étape consistant à retirer le premier film métallique à l'aide d'un premier liquide de gravure, tout en utilisant le troisième film métallique comme masque.
(JA) 本発明は、線幅が細く、基板への密着性に優れた金属細線を備える導電性フィルムを簡便に製造することを課題とする。 本発明の導電性フィルムの製造方法は、基板の少なくとも一方の主面上に、第一金属膜を形成する工程と、第一金属膜上に、第一金属膜の主成分とは異なる成分を主成分として含有する第二金属膜を形成する工程と、第二金属膜上に、金属細線が形成される領域に、線幅が2.0μm以下である開口部を備えるレジスト膜を形成する工程と、第三金属膜を形成する工程と、レジスト膜を除去する工程と、第三金属膜をマスクとして、第二エッチング液を用いて、第二金属膜を除去する工程と、第三金属膜をマスクとして、第一エッチング液を用いて、第一金属膜を除去する工程と、をこの順に有する。
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)