Search International and National Patent Collections

1. (WO2018042973) POWER MODULE AND METHOD FOR MANUFACTURING SAME

Pub. No.:    WO/2018/042973    International Application No.:    PCT/JP2017/027407
Publication Date: Fri Mar 09 00:59:59 CET 2018 International Filing Date: Sat Jul 29 01:59:59 CEST 2017
IPC: H01L 23/24
H01L 23/28
H01L 23/29
H01L 23/31
H01L 25/07
H01L 25/18
H02M 1/00
Applicants: MITSUBISHI ELECTRIC CORPORATION
三菱電機株式会社
Inventors: TAYA, Masaki
田屋 昌樹
Title: POWER MODULE AND METHOD FOR MANUFACTURING SAME
Abstract:
Provided is a power module capable of suppressing deterioration of insulation performance and ensuring the insulation performance by suppressing occurrence of air bubbles in a silicone gel, and peeling between the silicone gel and an insulating substrate at a high temperature, low temperature, and low atmospheric pressure. This power module is provided with: an insulating substrate (2) having a power semiconductor element (7) that is mounted on the front surface; a base plate (1) bonded to the rear surface of the insulating substrate (2); a case (3), which is fixed to the base plate (1), and which surrounds the insulating substrate (2); a cover (4), which is fixed to the case (3), and which forms an airtight region; and a silicone gel (11), i.e., a filling member, which is applied to the whole region of the airtight region, and internal stress of which is kept at compression stress.