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|1. (WO2018042973) POWER MODULE AND METHOD FOR MANUFACTURING SAME|
|Applicants:||MITSUBISHI ELECTRIC CORPORATION
|Title:||POWER MODULE AND METHOD FOR MANUFACTURING SAME|
Provided is a power module capable of suppressing deterioration of insulation performance and ensuring the insulation performance by suppressing occurrence of air bubbles in a silicone gel, and peeling between the silicone gel and an insulating substrate at a high temperature, low temperature, and low atmospheric pressure. This power module is provided with: an insulating substrate (2) having a power semiconductor element (7) that is mounted on the front surface; a base plate (1) bonded to the rear surface of the insulating substrate (2); a case (3), which is fixed to the base plate (1), and which surrounds the insulating substrate (2); a cover (4), which is fixed to the case (3), and which forms an airtight region; and a silicone gel (11), i.e., a filling member, which is applied to the whole region of the airtight region, and internal stress of which is kept at compression stress.