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1. (WO2018042552) SUBSTRATE TREATMENT DEVICE, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, AND RECORDING MEDIUM

Pub. No.:    WO/2018/042552    International Application No.:    PCT/JP2016/075488
Publication Date: Fri Mar 09 00:59:59 CET 2018 International Filing Date: Thu Sep 01 01:59:59 CEST 2016
IPC: H01L 21/268
H01L 21/02
H01L 21/20
H05B 6/68
Applicants: KOKUSAI ELECTRIC CORPORATION
株式会社KOKUSAI ELECTRIC
Inventors: HIROCHI, Yukitomo
廣地 志有
YANAGISAWA, Yoshihiko
柳沢 愛彦
Title: SUBSTRATE TREATMENT DEVICE, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, AND RECORDING MEDIUM
Abstract:
Provided is a technology having: a heating device that heats a substrate using electromagnetic waves; a non-contact-type temperature measuring device that measures the temperature of the substrate; and a control unit, which acquires temperature data measured by the temperature measuring device, and which compares the temperature data with an upper limit temperature and a lower limit temperature, which have been set as threshold values, said control unit performing a control so as to reduce output of the heating device or to turn off a power supply of the heating device, in the cases where the temperature data is higher than the upper limit temperature or the temperature data is lower than the lower limit temperature. Consequently, an electromagnetic wave heat treatment technology whereby deformation or breakage of the substrate can be suppressed can be provided.