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1. (WO2018042369) THERMAL INSULATION STRUCTURE FOR A LIQUID ENCLOSURE

Pub. No.:    WO/2018/042369    International Application No.:    PCT/IB2017/055248
Publication Date: Fri Mar 09 00:59:59 CET 2018 International Filing Date: Fri Sep 01 01:59:59 CEST 2017
IPC: E04H 4/10
Applicants: INTEX INDUSTRIES XIAMEN CO. LTD.
Inventors: HSU, Yaw Yuan
LIN, Hua Hsiang
Title: THERMAL INSULATION STRUCTURE FOR A LIQUID ENCLOSURE
Abstract:
A thermal insulation structure for liquid enclosures (4) is provided. The thermal insulation structure improves the liquid enclosure's thermal insulation thereby requiring less work by external components to maintain the temperature within the liquid enclosure (4). The thermal insulation structure includes a cover (10) and/or a plug (3). Both the cover (10) and the plug (3) each include a plurality of layers, which contribute to their insulating properties.