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1. (WO2018042120) DEVICE FOR TREATING PARTS

Pub. No.:    WO/2018/042120    International Application No.:    PCT/FR2017/052298
Publication Date: Fri Mar 09 00:59:59 CET 2018 International Filing Date: Wed Aug 30 01:59:59 CEST 2017
IPC: H01L 31/18
C23C 16/458
H01L 21/67
H01L 21/683
H01L 21/687
Applicants: SEMCO TECHNOLOGIES
Inventors: LAZZARELLI, Guy
SEMMACHE, Bachir
TRAN, Stéphanie
Title: DEVICE FOR TREATING PARTS
Abstract:
The invention relates to a device (50) for treating semiconductor substrates (60), the device comprising an enclosure (52) and at least one circuit (68, 70) for feeding a gaseous mixture into the enclosure, the enclosure containing at least one support (54), the support comprising a stack of plates (58) on which the semiconductor substrates are supported, each plate having a substantially horizontal face on which at least one of the semiconductor substrates is supported, wherein at least one of the plates comprises at least one passage for the gaseous mixture between the substrate and the plate.