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1. (WO2018041635) ULTRASOUND PROBE WITH DIGITAL MICROBEAMFORMER HAVING INTEGRATED CIRCUITS FABRICATED WITH DIFFERENT MANUFACTURING PROCESSES
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Pub. No.: WO/2018/041635 International Application No.: PCT/EP2017/070803
Publication Date: 08.03.2018 International Filing Date: 17.08.2017
IPC:
G01S 7/52 (2006.01) ,G01S 15/89 (2006.01)
G PHYSICS
01
MEASURING; TESTING
S
RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
7
Details of systems according to groups G01S13/, G01S15/, G01S17/127
52
of systems according to group G01S15/58
G PHYSICS
01
MEASURING; TESTING
S
RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
15
Systems using the reflection or reradiation of acoustic waves, e.g. sonar systems
88
Sonar systems, specially adapted for specific applications
89
for mapping or imaging
Applicants:
KONINKLIJKE PHILIPS N.V. [NL/NL]; High Tech Campus 5 5656 AE Eindhoven, NL
Inventors:
SAVORD, Bernard Joseph; NL
VAN RENS, Antonia Cornelia; NL
OUZOUNOV, Sotir Filipov; NL
POLAND, Mckee Dunn; NL
LEDOUX, Nik; NL
Agent:
MUMBRU FORN, José; FR
DE HAAN, Poul, Erik; FR
Priority Data:
16193775.013.10.2016EP
62/382,83102.09.2016US
62/382,83802.09.2016US
Title (EN) ULTRASOUND PROBE WITH DIGITAL MICROBEAMFORMER HAVING INTEGRATED CIRCUITS FABRICATED WITH DIFFERENT MANUFACTURING PROCESSES
(FR) SONDE À ULTRASONS AVEC MICROFORMEUR DE FAISCEAU NUMÉRIQUE COMPORTANT DES CIRCUITS INTÉGRÉS FABRIQUÉS SELON DIFFÉRENTS PROCÉDÉS DE FABRICATION
Abstract:
(EN) An ultrasound probe contains an array transducer and a microbeamformer coupled to elements of the array. The microbeamformer comprises one or more analog ASICs containing transmitters and amplifiers coupled to transducer elements, and one or more digital ASICs containing analog to digital converters and digital beamforming circuitry. The analog ASICs and the digital ASICs are manufactured by different integrated circuit 5 processes, with that of the analog ASIC optimized for high voltage analog operation and that of the digital ASICs optimized for high density, low voltage digital circuitry.
(FR) L'invention concerne une sonde à ultrasons contenant un transducteur en réseau et un microformeur de faisceau couplé à des éléments du réseau. Le microformeur de faisceau comprend un ou plusieurs ASIC analogiques contenant des émetteurs et des amplificateurs couplés à des éléments transducteurs, et un ou plusieurs ASIC numériques contenant des convertisseurs analogique-numérique et des circuits de formation de faisceaux numériques. Les ASIC analogiques et les ASIC numériques sont fabriqués à l'aide de différents procédés de circuits intégrés, celui de l'ASIC analogique étant optimisé pour un fonctionnement analogique à haute tension et celui des ASIC numériques étant optimisé pour des circuits numériques à haute densité et basse tension.
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: English (EN)
Filing Language: English (EN)