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1. (WO2018041595) CIRCUIT BOARD AND METHOD FOR PRODUCTION THEREOF

Pub. No.:    WO/2018/041595    International Application No.:    PCT/EP2017/070360
Publication Date: Fri Mar 09 00:59:59 CET 2018 International Filing Date: Fri Aug 11 01:59:59 CEST 2017
IPC: H05K 1/02
Applicants: SCHWEIZER ELECTRONIC AG
CONTINENTAL AUTOMOTIVE GMBH
Inventors: TRAGESER, Hubert
NEUMANN, Alexander
Title: CIRCUIT BOARD AND METHOD FOR PRODUCTION THEREOF
Abstract:
The invention relates to a circuit board (10, 10', 10'') comprising at last one insulating substrate layer (SL1, SL2, SL3, S14, SL5) and a plurality of electrically conductive copper coats (C1, C2, C3) arranged on the at least one insulating substrate layer (SL1, SL2, SL3, S14, SL5), wherein at least one of the electrically conductive copper coats (C1, C2, C3) is coated at least on both sides with a layer (HS1, HS2, HS3) made of a material for inhibiting electromigration, wherein on a layer (HS1, HS2) made of a material for inhibiting electromigration a further metal layer (M1, M2, M3, M3') is provided, which is in turn coated with a further layer (HS3, HS3') made of a material for inhibiting electromigration.