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1. (WO2018041416) METHOD FOR PRODUCING A PLATE HEAT EXCHANGER BLOCK WITH TARGETED APPLICATION OF THE SOLDER MATERIAL TO FINS AND SIDEBARS IN PARTICULAR

Pub. No.:    WO/2018/041416    International Application No.:    PCT/EP2017/025247
Publication Date: Fri Mar 09 00:59:59 CET 2018 International Filing Date: Fri Sep 01 01:59:59 CEST 2017
IPC: B23K 1/00
B23K 1/008
B23K 1/20
F28F 3/02
F28D 9/00
B23K 101/14
Applicants: LINDE AKTIENGESELLSCHAFT
Inventors: AIGNER, Herbert
MATHE, Günther
Title: METHOD FOR PRODUCING A PLATE HEAT EXCHANGER BLOCK WITH TARGETED APPLICATION OF THE SOLDER MATERIAL TO FINS AND SIDEBARS IN PARTICULAR
Abstract:
The present invention relates to a method for producing a soldered plate heat exchanger block (11), which has a plurality of heat exchange passages (1) for indirect heat exchange between at least two fluids, wherein the plate heat exchanger block (11) is made up of separating plates (4), sidebars (8) and heat conducting structures (3) as components (4, 8, 3), wherein the heat conducting structures (3) have or form a corrugated structure with alternately arranged corrugation peaks and troughs (12, 14) and corrugation flanks (13), and wherein the corrugation peaks and troughs (12, 14) are arranged parallel to one another. The method has the following steps: arranging the components (3, 4, 8) in a stack (11) by arranging the separating plates (4) in parallel while inserting sidebars (8) and heat conducting structures (3) between the separating plates (4), and soldering the stack (11). Before arranging the components (3, 4, 8) in a stack, solder material (L) is applied to one or more of the components (3, 4, 8) of the plate heat exchanger block (11) in such a way that a respective abutting area (8a, 8b) of the sidebars (8), a respective abutting area (12b, 14a) of the heat conducting structures (3) and/or a respective abutting region (4a, 4b) of the separating plates (4) is formed by solder, and that, when viewed after arranging the components (3, 4, 8) in the stack (11) and before soldering the stack (11), surface regions (15) that are located on one side (4.1, 4.2) of a respective separating plate (4) between the abutting regions (4a, 4b) and/or the abutting areas (8a, 8b, 12b, 14a) are free from a solder layer (L) or are not in contact with a solder layer (L).