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1. (WO2018041145) FINGERPRINT MODULE, METHOD FOR FABRICATING THE SAME, AND MOBILE TERMINAL
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Pub. No.: WO/2018/041145 International Application No.: PCT/CN2017/099697
Publication Date: 08.03.2018 International Filing Date: 30.08.2017
IPC:
G06K 9/00 (2006.01)
G PHYSICS
06
COMPUTING; CALCULATING; COUNTING
K
RECOGNITION OF DATA; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
9
Methods or arrangements for reading or recognising printed or written characters or for recognising patterns, e.g. fingerprints
Applicants:
GUANGDONG OPPO MOBILE TELECOMMUNICATIONS CORP.,LTD. [CN/CN]; NO.18 Haibin Road, Wusha, Chang'an Dongguan, Guangdong 523860, CN
Inventors:
ZHANG, Wenzhen; CN
Agent:
ESSEN PATENT&TRADEMARK AGENCY; Hailrun Complex Block A Room 1709-1711 No.6021 Shennan Blvd, Futian District ShenZhen, Guangdong 518040, CN
Priority Data:
201610771828.630.08.2016CN
Title (EN) FINGERPRINT MODULE, METHOD FOR FABRICATING THE SAME, AND MOBILE TERMINAL
(FR) MODULE D'EMPREINTE DIGITALE, SON PROCÉDÉ DE FABRICATION, ET TERMINAL MOBILE
Abstract:
(EN) Disclosed are a fingerprint module, a method for fabricating the same, and a mobile terminal. The fingerprint module has a fingerprint chip and a circuit board. The fingerprint chip has an identifying surface and a connecting surface opposite to the identifying surface, wherein the identifying surface is configured to identify a fingerprint of a user. The circuit board is attached to the connecting surface, wherein a sealing adhesive is disposed between the circuit board and the fingerprint chip.
(FR) L'invention concerne un module d'empreinte digitale, son procédé de fabrication, et un terminal mobile. Le module d'empreinte digitale comporte une puce d'empreinte digitale et une carte de circuit imprimé. La puce d'empreinte digitale a une surface d'identification et une surface de connexion opposée à la surface d'identification, la surface d'identification étant configurée pour identifier une empreinte digitale d'un utilisateur. La carte de circuit imprimé est fixée à la surface de connexion, un adhésif d'étanchéité étant disposé entre la carte de circuit imprimé et la puce d'empreinte digitale.
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: English (EN)
Filing Language: English (EN)