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1. (WO2018040950) TRANSPARENT CIRCUIT BOARD

Pub. No.:    WO/2018/040950    International Application No.:    PCT/CN2017/097974
Publication Date: Fri Mar 09 00:59:59 CET 2018 International Filing Date: Sat Aug 19 01:59:59 CEST 2017
IPC: H05K 1/03
H05K 1/09
Applicants: GUANGZHOU QIHONG ELECTRONIC TECHNOLOGY CO., LTD.
广州市祺虹电子科技有限公司
Inventors: LI, Tianqi
李天奇
Title: TRANSPARENT CIRCUIT BOARD
Abstract:
A transparent circuit board comprises: a transparent conductive substrate (1), at least one circuit layer (2, 6) being provided on the transparent conductive substrate, an insulating layer (5) being provided between circuit layers, etching points (501) on the insulating layer being connected to a conductive connection potential of two adjacent circuit layers, and the transparent conductive substrate being plated, by means of magnetron sputtering, with at least two layers of metal material layers to form an electrode (3) for the circuit layers. The transparent circuit board is characterized by solid solder joints, which do not easily fall off.