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1. (WO2018040476) DIE-BONDING GLUE AND PHOTOELECTRIC ELEMENT PACKAGING STRUCTURE
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Pub. No.: WO/2018/040476 International Application No.: PCT/CN2017/070845
Publication Date: 08.03.2018 International Filing Date: 11.01.2017
IPC:
H01L 33/56 (2010.01)
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
33
Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
48
characterised by the semiconductor body packages
52
Encapsulations
56
Materials, e.g. epoxy or silicone resin
Applicants:
肥城芯联新材料科技有限公司 FEICHENG XINLIAN NEW MATERIALS TECHNOLOGY CO.,LTD. [CN/CN]; 中国山东省泰安市 肥城市工业三路科技孵化器大楼 Technology Incubation Building 3rd Industry Road, Feicheng City Tai'an, Shandong 271600, CN
Inventors:
尤君平 YOU, Junping; CN
Agent:
深圳市世纪恒程知识产权代理事务所 CENFO INTELLECTUAL PROPERTY AGENCY; 中国广东省深圳市 南山区南山大道3838号设计产业园金栋二层210-212(原南头城工业村11栋) Room 210-212,2/F,Building "Golden"(Block 11,Industrial Village of Former Nantou Cheng) Design Industrial Park,No 3838,Nanshan Road, Nanshan District Shenzhen City, Guangdong 518052, CN
Priority Data:
201610792711.631.08.2016CN
Title (EN) DIE-BONDING GLUE AND PHOTOELECTRIC ELEMENT PACKAGING STRUCTURE
(FR) COLLE DE FIXATION DE PUCE ET STRUCTURE D'EMBALLAGE D'ÉLÉMENT PHOTOÉLECTRIQUE
(ZH) 固晶胶及光电元件封装结构
Abstract:
(EN) A die-bonding glue (10), comprising a base body. The refractive index of the die-bonding glue (10) is 1.4 to 2.7. The die-bonding glue (10) is applied to a photoelectric element packaging structure (100). The photoelectric element packaging structure (100) has a better light extraction efficiency.
(FR) L'invention concerne une colle de fixation de puce (10), comprenant un corps de base. L'indice de réfraction de la colle de fixation de puce (10) est de 1,4 à 2,7. La colle de fixation de puce (10) est appliquée à une structure d'encapsulation d'élément photoélectrique (100). La structure d'encapsulation d'élément photoélectrique (100) a une meilleure efficacité d'extraction de lumière.
(ZH) 一种固晶胶(10),包含基体,所述固晶胶(10)的折射率为1.4~2.7。一种应用该固晶胶(10)的光电元件封装结构(100),该光电元件封装结构(100)具有较佳的出光效率。
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Chinese (ZH)
Filing Language: Chinese (ZH)