Some content of this application is unavailable at the moment.
If this situation persist, please contact us atFeedback&Contact
1. (WO2018040394) LOUDSPEAKER MODULE
Latest bibliographic data on file with the International Bureau    Submit observation

Pub. No.: WO/2018/040394 International Application No.: PCT/CN2016/111112
Publication Date: 08.03.2018 International Filing Date: 20.12.2016
IPC:
H04R 9/06 (2006.01) ,C01B 39/08 (2006.01)
H ELECTRICITY
04
ELECTRIC COMMUNICATION TECHNIQUE
R
LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
9
Transducers of moving-coil, moving-strip, or moving-wire type
06
Loudspeakers
C CHEMISTRY; METALLURGY
01
INORGANIC CHEMISTRY
B
NON-METALLIC ELEMENTS; COMPOUNDS THEREOF
39
Compounds having molecular sieve and base-exchange properties, e.g. crystalline zeolites; Their preparation; After-treatment, e.g. ion-exchange or dealumination
02
Crystalline aluminosilicate zeolites; Isomorphous compounds thereof; Direct preparation thereof; Preparation thereof starting from a reaction mixture containing a crystalline zeolite of another type, or from preformed reactants: After-treatment thereof
06
Preparation of isomorphous zeolites characterised by measures to replace the aluminium or silicon atoms in the lattice framework by atoms of other elements
08
the aluminium atoms being wholly replaced
Applicants:
歌尔股份有限公司 GOERTEK.INC [CN/CN]; 中国山东省潍坊市 高新技术开发区东方路268号 268 Dongfang Road, Hi-Tech Industry District Weifang City, Shandong 261031, CN
Inventors:
曹晓东 CAO, Xiaodong; CN
刘金利 LIU, Jinli; CN
Agent:
北京博雅睿泉专利代理事务所(特殊普通合伙) BEYOND TALENT PATENT AGENT FIRM; 中国北京市 朝阳区朝阳门外大街10号昆泰大厦1202单元 Room 1202, Kuntai Building #10 Chaoyangmenwai Str., Chaoyang District Beijing 100020, CN
Priority Data:
201610789836.331.08.2016CN
Title (EN) LOUDSPEAKER MODULE
(FR) MODULE DE HAUT-PARLEUR
(ZH) 扬声器模组
Abstract:
(EN) A loudspeaker module, comprising a module shell having an accommodation cavity; a loudspeaker assembly arranged inside the accommodation cavity and dividing the accommodation cavity into a rear acoustic cavity and a front sound generating region; and aluminosilicate-free zeolite particles (1) filled in the rear acoustic cavity, the aluminosilicate-free zeolite particles (1) being formed by bonding raw zeolite powder particulates (11) with a binder, wherein the raw zeolite powder particulates (11) have primary pore channels with a pore diameter ranging from 0.3 nm to 20 nm, and in the aluminosilicate-free zeolite particles (1) there are secondary pore channels (3) between the raw zeolite powder particulates (11). Provided is a loudspeaker module having a lower resonant frequency.
(FR) L'invention concerne un module de haut-parleur, comprenant une coque de module ayant une cavité de réception ; un ensemble haut-parleur disposé à l'intérieur de la cavité de réception et divisant la cavité de réception en une cavité acoustique arrière et une région de génération de son avant ; et des particules de zéolite exemptes d'aluminosilicate (1) remplies dans la cavité acoustique arrière, les particules de zéolite exemptes d'aluminosilicate (1) étant formées par liaison de particules de poudre de zéolite brute (11) avec un liant, les particules de poudre de zéolite brutes (11) ont des canaux de pores primaires ayant un diamètre de pore allant de 0,3 nm à 20 nm, et dans les particules de zéolite exemptes d'aluminosilicate (1) se trouvent des canaux de pores secondaires (3) entre les particules de poudre de zéolite brutes (11). L'invention concerne un module de haut-parleur ayant une fréquence de résonance inférieure.
(ZH) 一种扬声器模组,包括:模组壳体,模组壳体具有容纳腔;扬声器组件,扬声器组件设置在容纳腔中,扬声器组件将容纳腔分割为后声腔和前出声区;填充在后声腔内的无铝硅酸盐沸石颗粒(1),无铝硅酸盐沸石颗粒(1)由沸石原粉微粒(11)经粘接剂粘接构成;其中,沸石原粉微粒(11)具有一级孔道,一级孔道的孔径范围为0.3-20nm,在无铝硅酸盐沸石颗粒(1)中,沸石原粉微粒(11)之间具有二级孔道(3)。提供了一种具有更低的谐振频率的扬声器模组。
front page image
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Chinese (ZH)
Filing Language: Chinese (ZH)