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1. (WO2018039248) REMOVAL OF DEBRIS ASSOCIATED WITH LASER DRILLING OF TRANSPARENT MATERIALS
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Pub. No.: WO/2018/039248 International Application No.: PCT/US2017/048041
Publication Date: 01.03.2018 International Filing Date: 22.08.2017
IPC:
B23K 26/16 (2006.01) ,B23K 26/38 (2006.01) ,B23K 103/00 (2006.01)
B PERFORMING OPERATIONS; TRANSPORTING
23
MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
K
SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
26
Working by laser beam, e.g. welding, cutting, boring
16
Removing of by-products, e.g. particles or vapours produced during treatment of a workpiece
B PERFORMING OPERATIONS; TRANSPORTING
23
MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
K
SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
26
Working by laser beam, e.g. welding, cutting, boring
36
Removing material
38
by boring or cutting
B PERFORMING OPERATIONS; TRANSPORTING
23
MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
K
SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
103
Materials to be soldered, welded or cut
Applicants:
ELECTRO SCIENTIFIC INDUSTRIES, INC. [US/US]; 13900 NW Science Park Drive Portland, OR 97229, US
Inventors:
KIM, Kyung, Y.; US
KOSMOWSKI, Mark; US
Agent:
EATON, Kurt, M.; US
Priority Data:
62/378,46323.08.2016US
Title (EN) REMOVAL OF DEBRIS ASSOCIATED WITH LASER DRILLING OF TRANSPARENT MATERIALS
(FR) ÉLIMINATION DE DÉBRIS ASSOCIÉS AU PERÇAGE PAR LASER DE MATÉRIAUX TRANSPARENTS
Abstract:
(EN) A laser target on a transparent workpiece (100) can be positioned over a vacuum cavity (1104). The vacuum cavity may be supplied with a debris collection fluid, such as air, through an entrance conduit (1208) to establish a vortex (1204) beneath a feature (1100) intended to be machined. The vortex facilitates removal of laser-generated debris (1106) during pass-through bottom-to-top machining of the feature.
(FR) Selon l'invention, une cible laser sur une pièce transparente (100) peut être positionnée sur une cavité sous vide (1104). La cavité sous vide peut être alimentée par un fluide de collecte de débris, tel que de l'air, par un conduit d'entrée (1208) pour établir un tourbillon (1204) en dessous d'un élément (1100) destiné à être usiné. Le tourbillon facilite l'élimination de débris générés par laser (1106) pendant le passage de l'usinage de bas en haut de l'élément.
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: English (EN)
Filing Language: English (EN)