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1. (WO2018039085) FLUIDIC ASSEMBLY PROCESS USING PIEZOELECTRIC PLATES

Pub. No.:    WO/2018/039085    International Application No.:    PCT/US2017/047693
Publication Date: Fri Mar 02 00:59:59 CET 2018 International Filing Date: Sun Aug 20 01:59:59 CEST 2017
IPC: H01L 41/113
H01L 41/313
H01L 41/311
H01L 33/00
H01L 27/15
H01L 33/30
Applicants: SHARP KABUSHIKI KAISHA
Inventors: CROWDER, Mark
ZHAN, Changqing
NISHIMURA, Karen
SCHUELE, Paul
Title: FLUIDIC ASSEMBLY PROCESS USING PIEZOELECTRIC PLATES
Abstract:
A method is provided for fabricating a thin-film electronic device employing a piezoelectric plate. The method provides a plurality of piezoelectric plates, and a substrate with electronic devices, each electronic device including a top surface well. A piezoelectric plate suspension is formed and flowed over the substrate. In response to the piezoelectric plate suspension flow, piezoelectric plates are captured in the top surface wells. The electric device top surface wells have well bottom surfaces, with bottom electrical contacts formed on the bottom surfaces. Thus, the capture of a piezoelectric plate in a top surface well entails interfacing a piezoelectric plate electrode, either the first electrode or the second electrode, to the bottom electrical contact. Subsequent to capturing the piezoelectric plates in the top surface wells, a thin -film process forms a conductive line overlying the exposed piezoelectric device electrode (i.e., the electrode not connected to the bottom electrical contact).