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1. (WO2018038892) SELF-HEALING SEMICONDUCTOR WAFER PROCESSING
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Pub. No.: WO/2018/038892 International Application No.: PCT/US2017/045348
Publication Date: 01.03.2018 International Filing Date: 03.08.2017
IPC:
H01L 21/66 (2006.01) ,H01L 21/67 (2006.01)
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21
Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
66
Testing or measuring during manufacture or treatment
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21
Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
67
Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
Applicants:
APPLIED MATERIALS, INC. [US/US]; 3050 Bowers Avenue Santa Clara, California 95054, US
Inventors:
KHAJA, Abdul Aziz; US
Agent:
PATTERSON, B. Todd; US
VER STEEG, Steven H.; US
Priority Data:
62/380,25426.08.2016US
Title (EN) SELF-HEALING SEMICONDUCTOR WAFER PROCESSING
(FR) TRAITEMENT DE PLAQUETTE SEMI-CONDUCTRICE AUTORÉPARATEUR
Abstract:
(EN) Implementations of the present disclosure generally relate to methods for processing substrates, and more particularly, to methods for predicting, quantifying and correcting process drift. In one implementation, the method includes performing a design of experiments (DOE) in a process chamber to obtain senor readings and film properties at multiple locations on a substrate for every adjustable process control change associated with the process chamber, building a regression model for each location on the substrate using the sensor readings and film properties obtained from the DOE, tracking changes in sensor readings during production, identifying drifting in sensor readings that can lead to a change in film properties using the regression model, and adjusting one or more process controls to correct the drifting in sensor readings to minimize the change in film properties.
(FR) Des modes de réalisation de la présente invention concernent généralement des procédés de traitement de substrats et, plus particulièrement, des procédés de prédiction, de quantification et de correction de dérive de processus. Dans un mode de réalisation, le procédé comprend la conduite d’une conception d’essais (DOE) dans une chambre de traitement pour obtenir des lectures de capteur et des propriétés de film à des emplacements multiples sur un substrat pour chaque changement de commande de processus réglable associé à la chambre de traitement, la construction d’un modèle de régression pour chaque emplacement sur le substrat au moyen des lectures de capteur et des propriétés de film obtenues à partir de la DOE, le suivi de changements des lectures de capteur pendant la production, l’identification de la dérive dans des lectures de capteur qui peuvent conduire à un changement des propriétés de film au moyen du modèle de régression, et l’ajustement d’une ou plusieurs commandes de processus pour corriger la dérive des lectures de capteur afin de réduire au minimum le changement des propriétés de film.
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: English (EN)
Filing Language: English (EN)