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1. (WO2018038808) WAFER PROCESSING EQUIPMENT HAVING EXPOSABLE SENSING LAYERS

Pub. No.:    WO/2018/038808    International Application No.:    PCT/US2017/039781
Publication Date: Fri Mar 02 00:59:59 CET 2018 International Filing Date: Thu Jun 29 01:59:59 CEST 2017
IPC: H01L 21/67
H01L 21/66
Applicants: APPLIED MATERIALS, INC.
Inventors: TEDESCHI, Leonard
JI, Lili
JOUBERT, Olivier
LUBOMIRSKY, Dimtry
KRAUS, Philip Allan
MCCORMICK, Daniel T.
Title: WAFER PROCESSING EQUIPMENT HAVING EXPOSABLE SENSING LAYERS
Abstract:
Embodiments include devices and methods for detecting particles, monitoring etch or deposition rates, or controlling an operation of a wafer fabrication process. In an embodiment, one or more micro sensors are mounted on wafer processing equipment, and are capable of measuring material deposition and removal rates in real-time. The micro sensors are selectively exposed such that a sensing layer of a micro sensor is protected by a mask layer during active operation of another micro sensor, and the protective mask layer may be removed to expose the sensing layer when the other micro sensor reaches an end-of-life. Other embodiments are also described and claimed.