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1. (WO2018038787) OFFSET LEADFRAME CASCODE PACKAGE

Pub. No.:    WO/2018/038787    International Application No.:    PCT/US2017/035377
Publication Date: Fri Mar 02 00:59:59 CET 2018 International Filing Date: Fri Jun 02 01:59:59 CEST 2017
IPC: H01L 23/495
Applicants: UNITED SILICON CARBIDE, INC.
Inventors: ZHANG, Hao
BHALLA, Anup
Title: OFFSET LEADFRAME CASCODE PACKAGE
Abstract:
A composite semiconductor device, such as a high-voltage cascode, is constructed in a single package by mounting a first die on a first planar substrate and second die mounted on a second planar substrate, where the substrates are separated by a gap filled with a dielectric encapsulant. The substrates may be separated both vertically and as well as laterally, to lie in different parallel planes. The substrates are in a leadframe that also includes interconnections, heat sinks, package pins, and removable tie-bars, forming a contiguous metallic structure. Multi-device frames containing multiple leadframes joined by additional tie-bars may be used to process multiple composite semiconductor devices together in, e.g., step-and-repeat wire and die bonding processes and batch encapsulation molding batch processes.