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1. (WO2018038707) INVERTED MICROSTRIP TRANSMISSION LINES FOR QUBITS

Pub. No.:    WO/2018/038707    International Application No.:    PCT/US2016/048101
Publication Date: Fri Mar 02 00:59:59 CET 2018 International Filing Date: Wed Aug 24 01:59:59 CEST 2016
IPC: H01P 3/00
H01P 3/08
Applicants: INTEL CORPORATION
Inventors: MICHALAK, David J.
ROBERTS, Jeanette M.
PILLARISETTY, Ravi
YOSCOVITS, Zachary R.
CLARKE, James S.
Title: INVERTED MICROSTRIP TRANSMISSION LINES FOR QUBITS
Abstract:
Described herein are new transmission line structures, and methods for fabrication thereof, for use as resonators and non-resonant interconnects in quantum circuits. In one aspect of the present disclosure, a proposed transmission line structure includes a substrate, a ground structure disposed over the substrate, and a signal path (i.e. a strip of a conductive material, preferably a superconductive material) suspended over the ground structure and supported by a signal path support layer. The proposed structure further includes an opening in the signal path support layer, the opening being indicative of using the fabrication process described herein for forming the proposed structure. Transmission line structures as proposed herein could be used for providing microwave connectivity to, from, or/and between the qubits, or to set the frequencies that address individual qubits.