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1. (WO2018038578) METHOD FOR PRETREATMENT AND PRINTING OF FLEXIBLE SUBSTRATE AND SYSTEM USING SAME
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Pub. No.: WO/2018/038578 International Application No.: PCT/KR2017/009331
Publication Date: 01.03.2018 International Filing Date: 25.08.2017
IPC:
H05K 3/12 (2006.01) ,H05K 3/28 (2006.01) ,H01J 37/32 (2006.01) ,H05K 1/09 (2006.01)
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3
Apparatus or processes for manufacturing printed circuits
10
in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
12
using printing techniques to apply the conductive material
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3
Apparatus or processes for manufacturing printed circuits
22
Secondary treatment of printed circuits
28
Applying non-metallic protective coatings
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
J
ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
37
Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
32
Gas-filled discharge tubes
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1
Printed circuits
02
Details
09
Use of materials for the metallic pattern
Applicants:
이명재 LEE, Myung Jae [KR/KR]; KR
강신욱 KANG, Shin Uk [KR/KR]; KR
김동민 KIM, Dong Min [KR/KR]; KR
Inventors:
이명재 LEE, Myung Jae; KR
강신욱 KANG, Shin Uk; KR
김동민 KIM, Dong Min; KR
Agent:
김인한 KIM, In Han; KR
Priority Data:
10-2016-010852325.08.2016KR
Title (EN) METHOD FOR PRETREATMENT AND PRINTING OF FLEXIBLE SUBSTRATE AND SYSTEM USING SAME
(FR) PROCÉDÉ DE PRÉTRAITEMENT ET D'IMPRESSION D'UN SUBSTRAT SOUPLE ET SYSTÈME L'UTILISANT
(KO) 유연성 기판의 전처리 및 인쇄 방법 및 이를 이용하는 시스템
Abstract:
(EN) Disclosed is a method for the pretreatment and printing of a flexible substrate. The method comprises the steps of: fixing a first pattern mask for the printing of at least one of an electrode and a circuit on the flexible substrate; performing a primary surface modification treatment on a portion of the flexible substrate exposed from the first pattern mask using an atmospheric-pressure plasma; forming at least one of the electrode and the circuit by printing a conductive ink on the primary surface modification treated portion of the flexible substrate; fixing a second pattern mask for an insulation treatment on the flexible substrate; performing a secondary surface modification treatment on a portion of the flexible substrate exposed from the second pattern mask using the atmospheric-pressure plasma; and forming an insulating film by printing a nonconductive ink on the secondary surface modification treated portion of the flexible substrate.
(FR) L'invention concerne un procédé de prétraitement et d'impression d'un substrat souple. Le procédé comprend les étapes consistant : à fixer un premier masque de motif destiné à l'impression d'une électrode et/ou d'un circuit sur le substrat souple ; à effectuer un traitement par modification de surface primaire sur une partie du substrat souple exposée à partir du premier masque de motif à l'aide d'un plasma à pression atmosphérique ; à former au moins l'électrode et/ou le circuit par impression d'une encre conductrice sur la partie traitée par modification de surface primaire du substrat souple ; à fixer un second masque de motif destiné à un traitement d'isolation sur le substrat souple ; à effectuer un traitement par modification de surface secondaire sur une partie du substrat souple exposée à partir du second masque de motif à l'aide du plasma à pression atmosphérique ; et à former un film isolant par impression d'une encre non conductrice sur la partie traitée par modification de surface secondaire du substrat souple.
(KO) 유연성 기판의 전처리 및 인쇄 방법이 개시된다. 이 방법은 유연성 기판 상에 전극 및 회로중 적어도 하나의 인쇄를 위한 제1 패턴 마스크를 고정하는 단계, 대기압 플라즈마를 이용하여 제1 패턴 마스크로부터 노츨된 유연성 기판의 부분을 1차 표면 개질 처리하는 단계, 1차 표면 개질 처리된 유연성 기판 부분 상에 도전성 잉크를 인쇄함으로써 전극 및 회로중 적어도 하나를 형성하는 단계, 유연성 기판 상에 절연 처리를 위한 제2 패턴 마스크를 고정하는 단계, 대기압 플라즈마를 이용하여 제2 패턴 마스크로부터 노츨된 유연성 기판의 부분을 2차 표면 개질 처리하는 단계, 및 2차 표면 개질 처리된 유연성 기판 부분 상에 비도전성 잉크를 인쇄함으로써 절연 막을 형성하는 단계를 포함한다.
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Korean (KO)
Filing Language: Korean (KO)