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1. (WO2018038569) COVER FOR FINGERPRINT SENSOR, AND PORTABLE ELECTRONIC DEVICE COMPRISING SAME
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Pub. No.: WO/2018/038569 International Application No.: PCT/KR2017/009306
Publication Date: 01.03.2018 International Filing Date: 25.08.2017
IPC:
G06K 9/00 (2006.01) ,C09J 133/00 (2006.01) ,C09J 167/00 (2006.01) ,C09J 175/04 (2006.01) ,C09J 163/00 (2006.01) ,C09D 5/16 (2006.01) ,H05K 5/00 (2006.01) ,C04B 35/48 (2006.01) ,B32B 18/00 (2006.01)
G PHYSICS
06
COMPUTING; CALCULATING; COUNTING
K
RECOGNITION OF DATA; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
9
Methods or arrangements for reading or recognising printed or written characters or for recognising patterns, e.g. fingerprints
C CHEMISTRY; METALLURGY
09
DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
J
ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
133
Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
C CHEMISTRY; METALLURGY
09
DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
J
ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
167
Adhesives based on polyesters obtained by reactions forming a carboxylic ester link in the main chain; Adhesives based on derivatives of such polymers
C CHEMISTRY; METALLURGY
09
DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
J
ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
175
Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
04
Polyurethanes
C CHEMISTRY; METALLURGY
09
DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
J
ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
163
Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
C CHEMISTRY; METALLURGY
09
DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
D
COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
5
Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
16
Anti-fouling paints; Underwater paints
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
5
Casings, cabinets or drawers for electric apparatus
C CHEMISTRY; METALLURGY
04
CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
B
LIME; MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
35
Shaped ceramic products characterised by their composition; Ceramic compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
01
based on oxides
48
based on zirconium or hafnium oxides or zirconates or hafnates
B PERFORMING OPERATIONS; TRANSPORTING
32
LAYERED PRODUCTS
B
LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
18
Layered products essentially comprising ceramics, e.g. refractory products
Applicants:
주식회사 아모센스 AMOSENSE CO.,LTD [KR/KR]; 충청남도 천안시 서북구 직산읍 4산단5길 90 (천안제4지방산업단지19-1블럭) (Cheonan the forth Local Industrial Complex 19-1 Block) 90, 4sandan 5-gil, Jiksan-eup, Seobuk-gu, Cheonan-si, Chungcheongnam-do 31040, KR
Inventors:
조성호 JO, Seong Ho; KR
오창우 OH, Chang Woo; KR
안영준 AN, Young Jun; KR
Agent:
특허법인 이룸리온 ERUUM & LEEON INTELLECTUAL PROPERTY LAW FIRM; 서울시 서초구 사평대로 108 3층 (반포동) (Banpo-dong) 3rd Floor, 108, Sapyeong-daero, Seocho-gu, Seoul 06575, KR
Priority Data:
10-2016-010951526.08.2016KR
10-2016-012325526.09.2016KR
10-2016-016864312.12.2016KR
10-2017-004963718.04.2017KR
Title (EN) COVER FOR FINGERPRINT SENSOR, AND PORTABLE ELECTRONIC DEVICE COMPRISING SAME
(FR) COUVERCLE POUR CAPTEUR D'EMPREINTES DIGITALES, ET DISPOSITIF ÉLECTRONIQUE PORTABLE LE COMPRENANT
(KO) 지문인식센서용 커버 및 이를 포함하는 휴대용 전자기기
Abstract:
(EN) A cover for a fingerprint sensor is provided. The cover for a fingerprint sensor, according to an exemplary embodiment of the present invention, which is disposed in front of a fingerprint sensor and comes into contact with a finger of a user, comprises: a ceramic body; and a shield layer formed on one surface of the ceramic body, for preventing the fingerprint sensor from being shown outside and also for providing adhesion so as to be capable of being attached to one surface of the fingerprint sensor.
(FR) La présente invention concerne un couvercle pour un capteur d'empreintes digitales. Le couvercle pour un capteur d'empreintes digitales, selon un exemple de mode de réalisation de la présente invention, qui est disposé devant un capteur d'empreintes digitales et entre en contact avec un doigt d'un utilisateur, comprend : un corps en céramique ; et une couche de blindage formée sur une surface du corps en céramique, pour empêcher le capteur d'empreintes digitales d'être exposé à l'extérieur et également pour assurer une adhérence de manière à pouvoir être fixé à une surface du capteur d'empreintes digitales.
(KO) 지문인식센서용 커버가 제공된다. 본 발명의 예시적인 실시예에 따른 지문인식센서용 커버는 지문인식센서의 전방에 배치되어 사용자의 손가락과 접촉되는 것으로서, 세라믹 소체; 및 상기 세라믹 소체의 일면에 형성되고, 상기 지문인식센서가 외부로 비치는 것을 방지함과 아울러 상기 지문인식센서의 일면에 부착될 수 있도록 접착력을 제공하는 쉴드층;을 포함한다.
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Korean (KO)
Filing Language: Korean (KO)