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1. (WO2018038475) PRESSURE-SENSITIVE ADHESIVE TAPE, METHOD FOR MANUFACTURING SAME, AND ELECTRONIC DEVICE COMPRISING SAME
Latest bibliographic data on file with the International Bureau    Submit observation

Pub. No.:    WO/2018/038475    International Application No.:    PCT/KR2017/009068
Publication Date: 01.03.2018 International Filing Date: 21.08.2017
IPC:
C09J 7/04 (2006.01), C09J 9/02 (2006.01)
Applicants: AMOGREENTECH CO., LTD. [KR/KR]; 91, Gimpo-daero 1950beon-gil, Tongjin-eup Gimpo-si Gyeonggi-do 10014 (KR)
Inventors: SEO, In Yong; (KR).
JEONG, Ui Young; (KR)
Agent: LEE, Jae Hwa; (KR)
Priority Data:
10-2016-0109245 26.08.2016 KR
Title (EN) PRESSURE-SENSITIVE ADHESIVE TAPE, METHOD FOR MANUFACTURING SAME, AND ELECTRONIC DEVICE COMPRISING SAME
(FR) RUBAN ADHÉSIF SENSIBLE À LA PRESSION, SON PROCÉDÉ DE FABRICATION, ET DISPOSITIF ÉLECTRONIQUE LE COMPRENANT
(KO) 감압성 점착테이프, 그의 제조방법 및 그를 구비한 전자기기
Abstract: front page image
(EN)The present invention relates to a pressure-sensitive adhesive tape, a method for manufacturing the same, and an electronic device comprising the same. The pressure-sensitive adhesive tape comprises: a fiber accumulation type substrate in which a plurality of fibers are accumulated to form a plurality of pores therebetween; a metal coating layer coated on the circumferential surfaces of the plurality of fibers of the fiber accumulation type substrate; and an electrically conductive adhesive layer formed on one side or both sides of the fiber accumulation type substrate on which the metal coating layer is formed, wherein the electrically conductive adhesive layer is formed of an electrically conductive adhesive material filled in the plurality of pores and is electrically connected by an applied pressure.
(FR)La présente invention concerne une bande adhésive sensible à la pression, un procédé de fabrication de cette dernière, et un dispositif électronique la comprenant. La bande adhésive sensible à la pression comprend : un substrat de type à accumulation de fibres dans lequel une pluralité de fibres sont accumulées pour former une pluralité de pores entre elles ; une couche de revêtement métallique appliquée sur les surfaces circonférentielles de la pluralité de fibres du substrat de type à accumulation de fibres ; et une couche adhésive électriquement conductrice formée sur un côté ou les deux côtés du substrat de type à accumulation de fibres sur lequel la couche de revêtement métallique est formée, la couche adhésive électroconductrice étant formée d'un matériau adhésif électroconducteur rempli dans la pluralité de pores et étant électriquement connectée par une pression appliquée.
(KO)본 발명은 감압성 점착테이프, 그의 제조방법 및 그를 구비한 전자기기에 관한 것으로, 감압성 점착테이프는 다수의 섬유가 축적되어 상기 다수의 섬유 사이에 다수의 기공이 형성된 섬유 축적형 기재; 상기 섬유 축적형 기재의 다수의 섬유 외주면에 코팅되는 금속 코팅층; 및 상기 금속 코팅층이 형성된 상기 섬유 축적형 기재의 일면 또는 양면에 형성되고 상기 다수의 기공에 충진된 전기전도성 점착물질로 이루어지고, 인가된 압력에 의해 전기적으로 연결되는 전기전도성 점착층;을 포함하는 것을 특징으로 한다.
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG).
Publication Language: Korean (KO)
Filing Language: Korean (KO)