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1. (WO2018038309) POLYIMIDE PRECURSOR RESIN COMPOSITION WITH IMPROVED RESIN STABILITY AND HEAT RESISTANCE AND HAVING TRANSPARENCY, METHOD FOR PRODUCING POLYIMIDE FILM USING SAME, AND POLYIMIDE FILM PRODUCED THEREBY
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Pub. No.: WO/2018/038309 International Application No.: PCT/KR2016/010435
Publication Date: 01.03.2018 International Filing Date: 20.09.2016
IPC:
C08G 73/10 (2006.01) ,C08J 5/18 (2006.01) ,C08L 79/08 (2006.01)
[IPC code unknown for C08G 73/10][IPC code unknown for C08J 5/18][IPC code unknown for C08L 79/08]
Applicants:
㈜대림코퍼레이션 DAELIM CORPORATION CO., LTD. [KR/KR]; 서울시 중구 세종대로 39, 11층 (남대문로4가, 대한상공회의소빌딩) (Namdaemunno 4-ga, the Korea Chamber of Commerce and Industry Bldg.) 11F, 39, Sejong-daero Jung-gu Seoul 04513, KR
Inventors:
강진수 KANG, Jin Soo; KR
김진모 KIM, Jin Mo; KR
안용호 AHN, Yong Ho; KR
오경옥 OH, Kyung Ok; KR
한승진 HAN, Seung Jin; KR
최은지 CHOI, Eun Gi; KR
Agent:
한라특허법인(유한) HALLA PATENT & LAW FIRM; 서울시 강남구 강남대로 262 9층 (캠코양재타워) (KAMCO Yangjae Tower) 9F, 262, Gangnam-daero Gangnam-gu Seoul 06265, KR
Priority Data:
10-2016-010725723.08.2016KR
Title (EN) POLYIMIDE PRECURSOR RESIN COMPOSITION WITH IMPROVED RESIN STABILITY AND HEAT RESISTANCE AND HAVING TRANSPARENCY, METHOD FOR PRODUCING POLYIMIDE FILM USING SAME, AND POLYIMIDE FILM PRODUCED THEREBY
(FR) COMPOSITION DE RÉSINE PRÉCURSEUR DE POLYIMIDE, TRANSPARENTE, PLUS STABLE ET PLUS RÉSISTANCE À LA CHALEUR, PROCÉDÉ DE PRODUCTION D'UN FILM DE POLYIMIDE UTILISANT LA COMPOSITION, ET FILM DE POLYIMIDE AINSI OBTENU
(KO) 수지안정성, 내열성이 향상되고 투명성을 갖는 폴리이미드 전구체 수지 조성물, 이를 이용한 폴리이미드 필름 제조방법, 및 이에 의해 제조된 폴리이미드 필름
Abstract:
(EN) The present invention relates to a transparent polyamic acid precursor resin composition which does not cause a white cloudy phenomenon during solution casting while having excellent mechanical properties, high heat resistance and low thermal expansion coefficient by optimizing aromatic diamine and acid dianhydride for improving heat resistance and mechanical properties, and an organic solvent in which a white turbidity phenomenon does not occur; a method for producing a polyimide film using the same; and a polyimide film produced thereby.
(FR) La présente invention concerne une composition de résine précurseur d'acide polyamique transparente qui ne provoque pas de phénomène de trouble blanc pendant la coulée en solution tout en ayant d'excellentes propriétés mécaniques, une résistance à la chaleur élevée et un faible coefficient de dilatation thermique par optimisation de diamine aromatique et de dianhydride d'acide pour améliorer la résistance à la chaleur et les propriétés mécaniques, et un solvant organique dans lequel un phénomène de turbidité blanche ne se produit pas; l'invention concerne aussi un procédé de production d'un film de polyimide utilisant la composition; et un film de polyimide ainsi obtenu.
(KO) 본 발명은 내열성 및 기계적 특성을 향상하기 위한 방향족 디아민 및 산 이무수물과, 백탁 현상이 발생되지 않는 유기 용매를 최적화함으로써, 우수한 기계적 물성, 고내열성, 낮은 열팽창계수를 갖으면서도 용액 캐스팅 시 백탁 현상이 발생하지 않는 투명 폴리아믹산 전구체 수지 조성물 및 이를 이용한 폴리이미드 필름 제조방법, 및 이에 의해 제조된 폴리이미드 필름에 관한 것이다.
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KN, KP, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Korean (KO)
Filing Language: Korean (KO)