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1. (WO2018038159) ELECTRONIC DEVICE HOUSING, METHOD FOR MANUFACTURING ELECTRONIC DEVICE HOUSING, DEVELOPMENT PLAN-SHAPED METAL RESIN JOINT PLATE, AND ELECTRONIC APPARATUS
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Pub. No.: WO/2018/038159 International Application No.: PCT/JP2017/030129
Publication Date: 01.03.2018 International Filing Date: 23.08.2017
IPC:
H05K 9/00 (2006.01) ,H05K 5/02 (2006.01) ,H05K 5/04 (2006.01)
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
9
Screening of apparatus or components against electric or magnetic fields
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
5
Casings, cabinets or drawers for electric apparatus
02
Details
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
5
Casings, cabinets or drawers for electric apparatus
04
Metal casings
Applicants:
三井化学株式会社 MITSUI CHEMICALS, INC. [JP/JP]; 東京都港区東新橋一丁目5番2号 5-2, Higashi-Shimbashi 1-chome, Minato-ku, Tokyo 1057122, JP
Inventors:
内藤 真哉 NAITO Shinya; JP
新堀 信義 SHINBORI Nobuyoshi; JP
Agent:
速水 進治 HAYAMI Shinji; JP
Priority Data:
2016-16552726.08.2016JP
2017-01026524.01.2017JP
Title (EN) ELECTRONIC DEVICE HOUSING, METHOD FOR MANUFACTURING ELECTRONIC DEVICE HOUSING, DEVELOPMENT PLAN-SHAPED METAL RESIN JOINT PLATE, AND ELECTRONIC APPARATUS
(FR) BOÎTIER DE DISPOSITIF ÉLECTRONIQUE, PROCÉDÉ DE FABRICATION DE BOÎTIER DE DISPOSITIF ÉLECTRONIQUE, PLAQUE D'ARTICULATION EN RÉSINE MÉTALLIQUE EN FORME DE PLAN DE DÉVELOPPEMENT, ET APPAREIL ÉLECTRONIQUE
(JA) 電子機器用筐体、電子機器用筐体の製造方法、展開図状金属樹脂接合板および電子装置
Abstract:
(EN) An electronic device housing (100) of the present invention is a housing for internally accommodating an electronic device, the housing provided with a metal bottom plate (201) and a metal side plate (202(202-1, 202-2, 202-3, and 202-4)) which is folded and integrally connected to the bottom plate (201). At least the bottom plate (201) and the side plate (202) constitute a metal member (M), wherein a thermoplastic resin member (301) is joined to a part of a surface of the metal member (M), which is planar, the metal member (M) is reinforced by the thermoplastic resin member (301), and the thermoplastic resin member (301) is joined to both sides of the planar metal member (M).
(FR) La présente invention concerne un boîtier de dispositif électronique (100) conçu pour recevoir un dispositif électronique, le boîtier comportant une plaque inférieure métallique (201) et une plaque latérale métallique (202(202-1, 202-2, 202-3, et 202-4)) qui est pliée et reliée d'un seul tenant à la plaque inférieure (201). Au moins la plaque inférieure (201) et la plaque latérale (202) constituent un élément métallique (M), un élément en résine thermoplastique (301) étant joint à une partie d'une surface de l'élément métallique (M), qui est plan, l'élément métallique (M) est renforcé par l'élément en résine thermoplastique (301), et l'élément en résine thermoplastique (301) est joint aux deux côtés de l'élément métallique plan (M).
(JA) 本発明の電子機器用筐体(100)は、金属製の底板(201)と、底板(201)に一体的に折り曲げられて連結された金属製の側板(202(202-1、202-2、202-3、および202-4))と、を備え、内部に電子機器を収容するための筐体であって、少なくとも底板(201)および側板(202)からなる金属部材(M)において、板状の金属部材(M)の表面の一部に熱可塑性樹脂部材(301)が接合され、金属部材(M)が熱可塑性樹脂部材(301)により補強されており、板状の金属部材(M)の両面に熱可塑性樹脂部材(301)が接合されている。
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)