Search International and National Patent Collections

1. (WO2018038153) MOUNTING METHOD AND MOUNTING DEVICE

Pub. No.:    WO/2018/038153    International Application No.:    PCT/JP2017/030101
Publication Date: Fri Mar 02 00:59:59 CET 2018 International Filing Date: Thu Aug 24 01:59:59 CEST 2017
IPC: H01L 21/60
Applicants: TORAY ENGINEERING CO., LTD.
東レエンジニアリング株式会社
Inventors: ARAI, Yoshiyuki
新井 義之
Title: MOUNTING METHOD AND MOUNTING DEVICE
Abstract:
The present invention addresses the problem of mounting a semiconductor chip stably on a circuit board with high accuracy. Specifically, a mounting method for mounting a semiconductor chip after dicing on a circuit board that is placed on a stage, said semiconductor chip having a first surface that is held by a carrier substrate. This mounting method is characterized by sequentially performing: an adhesive sheet bonding step wherein the second surface of the semiconductor chip, said second surface being on the reverse side of the first surface held by the carrier substrate, is bonded to an adhesive sheet; a carrier substrate removal step wherein the carrier substrate is removed from the semiconductor chip; an adhesive power reducing step wherein the adhesive power of the adhesive sheet is reduced; and a mounting step wherein the semiconductor chip is mounted on the circuit board by separating the semiconductor chip from the adhesive sheet by having a head hold the first surface of the semiconductor chip and subsequently bonding the second surface to the circuit board.