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1. (WO2018038134) CIRCUIT MODULE

Pub. No.:    WO/2018/038134    International Application No.:    PCT/JP2017/030045
Publication Date: Fri Mar 02 00:59:59 CET 2018 International Filing Date: Thu Aug 24 01:59:59 CEST 2017
IPC: H05K 1/02
H01L 23/29
H01L 23/31
H05K 3/28
Applicants: MURATA MANUFACTURING CO., LTD.
株式会社村田製作所
Inventors: OBATA, Takayoshi
小幡 孝義
Title: CIRCUIT MODULE
Abstract:
The purpose of the present invention is to prevent a localized concentration of stress and a resultant damage to a substrate when a circuit module is deformed. The circuit module is provided with: a base material including a mount area in which an electronic component is mounted; a lower layer which is formed extending from the mount area to an area other than the mount area on the base material, and which is made from a resin material; and an upper layer which is made from a resin material differing from the lower layer in hardness, and of which a periphery is positioned outside the mount area and inside the area in which the lower layer is formed.