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|1. (WO2018037997) PHOTOSENSITIVE RESIN COMPOSITION AND METHOD FOR PRODUCING CURED RELIEF PATTERN|
|Applicants:||ASAHI KASEI KABUSHIKI KAISHA
|Title:||PHOTOSENSITIVE RESIN COMPOSITION AND METHOD FOR PRODUCING CURED RELIEF PATTERN|
Provided is a negative photosensitive resin composition with which it is possible to produce a resin layer having a preferable imidation ratio and a high chemical resistance even under low-temperature curing condition of not higher than 200°C, and which contains a photopolymerization initiator (B) in a proportion of 0.1-20 parts by mass with respect to 100 parts by mass of a polyimide precursor (A), wherein: the polyimide precursor (A) is a polyamic acid ester or a polyamic acid salt that has a specific structure; and the polyimide precursor (A) has a weight average molecular weight (Mw) of not less than 3,000 but less than 16,000 in terms of polystyrene equivalent as measured by gel permeation chromatography (GPC).