Search International and National Patent Collections

1. (WO2018037997) PHOTOSENSITIVE RESIN COMPOSITION AND METHOD FOR PRODUCING CURED RELIEF PATTERN

Pub. No.:    WO/2018/037997    International Application No.:    PCT/JP2017/029554
Publication Date: Fri Mar 02 00:59:59 CET 2018 International Filing Date: Fri Aug 18 01:59:59 CEST 2017
IPC: G03F 7/037
C08G 73/10
Applicants: ASAHI KASEI KABUSHIKI KAISHA
旭化成株式会社
Inventors: YORISUE, Tomohiro
頼末 友裕
NAKAMURA, Mitsutaka
中村 光孝
INOUE, Taihei
井上 泰平
HIRATA, Tatsuya
平田 竜也
SASAKI, Takahiro
佐々木 隆弘
Title: PHOTOSENSITIVE RESIN COMPOSITION AND METHOD FOR PRODUCING CURED RELIEF PATTERN
Abstract:
Provided is a negative photosensitive resin composition with which it is possible to produce a resin layer having a preferable imidation ratio and a high chemical resistance even under low-temperature curing condition of not higher than 200°C, and which contains a photopolymerization initiator (B) in a proportion of 0.1-20 parts by mass with respect to 100 parts by mass of a polyimide precursor (A), wherein: the polyimide precursor (A) is a polyamic acid ester or a polyamic acid salt that has a specific structure; and the polyimide precursor (A) has a weight average molecular weight (Mw) of not less than 3,000 but less than 16,000 in terms of polystyrene equivalent as measured by gel permeation chromatography (GPC).