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1. (WO2018037969) CIRCUIT MODULE

Pub. No.:    WO/2018/037969    International Application No.:    PCT/JP2017/029312
Publication Date: Fri Mar 02 00:59:59 CET 2018 International Filing Date: Tue Aug 15 01:59:59 CEST 2017
IPC: H01L 25/00
H05K 1/18
Applicants: MURATA MANUFACTURING CO., LTD.
株式会社村田製作所
Inventors: ITO, Takanori
伊藤 貴紀
Title: CIRCUIT MODULE
Abstract:
A circuit module which is provided with: a substrate (10), on both surfaces of which electronic components such as IC chips (11) are mounted; sealing resins (30a, 30b) which seal at least the electronic components on the both surfaces of the substrate (10); and a circuit element (21) also serving as a terminal, which is provided with electrodes (21a) on both ends, and wherein one electrode (21a) is bonded to one surface of the substrate (10) by means of a conductive bonding member and the other electrode (21a) is exposed in the surface of the sealing resin (30b) such that the axis connecting the gravity centers of the electrodes (21a) on both ends is generally perpendicular to the substrate (10). The circuit element (21) also serving as a terminal has a void part (40a), where the conductive bonding member is not disposed, in the central part of the electrode (21a) that is connected to the substrate (10).