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1. (WO2018037842) CERAMIC SUBSTRATE, AND MODULE WITH BUILT-IN ELECTRONIC COMPONENT

Pub. No.:    WO/2018/037842    International Application No.:    PCT/JP2017/027723
Publication Date: Fri Mar 02 00:59:59 CET 2018 International Filing Date: Tue Aug 01 01:59:59 CEST 2017
IPC: H05K 3/38
C04B 41/90
H01L 23/13
H01L 25/00
H05K 1/03
H05K 3/46
Applicants: MURATA MANUFACTURING CO., LTD.
株式会社村田製作所
Inventors: ASAI, Ryota
浅井 良太
MATSUSHITA, Yosuke
松下 洋介
Title: CERAMIC SUBSTRATE, AND MODULE WITH BUILT-IN ELECTRONIC COMPONENT
Abstract:
This ceramic substrate is provided with: a ceramic element having a ceramic layer on the surface; and a surface electrode that is provided on one main surface of the ceramic element. The ceramic substrate is characterized in that: an oxide layer formed of an insulating oxide is formed between the surface electrode and the ceramic layer, said oxide having a melting point that is higher than the firing temperature of the ceramic layer; the oxide layer is also provided on a ceramic layer portion where the surface electrode is not provided; and the surface of the oxide layer on the ceramic layer portion where the surface electrode is not provided is a rough surface.