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1. (WO2018037551) OPTICAL MODULE FOR ENDOSCOPE, ENDOSCOPE, AND METHOD FOR MANUFACTURING OPTICAL MODULE FOR ENDOSCOPE
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Pub. No.: WO/2018/037551 International Application No.: PCT/JP2016/074956
Publication Date: 01.03.2018 International Filing Date: 26.08.2016
IPC:
A61B 1/04 (2006.01) ,A61B 1/00 (2006.01) ,G02B 6/42 (2006.01)
A HUMAN NECESSITIES
61
MEDICAL OR VETERINARY SCIENCE; HYGIENE
B
DIAGNOSIS; SURGERY; IDENTIFICATION
1
Instruments for performing medical examinations of the interior of cavities or tubes of the body by visual or photographical inspection, e.g. endoscopes; Illuminating arrangements therefor
04
combined with photographic or television appliances
A HUMAN NECESSITIES
61
MEDICAL OR VETERINARY SCIENCE; HYGIENE
B
DIAGNOSIS; SURGERY; IDENTIFICATION
1
Instruments for performing medical examinations of the interior of cavities or tubes of the body by visual or photographical inspection, e.g. endoscopes; Illuminating arrangements therefor
G PHYSICS
02
OPTICS
B
OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS
6
Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
24
Coupling light guides
42
Coupling light guides with opto-electronic elements
Applicants:
オリンパス株式会社 OLYMPUS CORPORATION [JP/JP]; 東京都八王子市石川町2951番地 2951 Ishikawa-machi, Hachioji-shi, Tokyo 1928507, JP
Inventors:
中川 悠輔 NAKAGAWA Yusuke; JP
Agent:
伊藤 進 ITOH Susumu; JP
Priority Data:
Title (EN) OPTICAL MODULE FOR ENDOSCOPE, ENDOSCOPE, AND METHOD FOR MANUFACTURING OPTICAL MODULE FOR ENDOSCOPE
(FR) MODULE OPTIQUE POUR ENDOSCOPE, ENDOSCOPE, ET PROCÉDÉ DE FABRICATION DE MODULE OPTIQUE POUR ENDOSCOPE
(JA) 内視鏡用光モジュール、内視鏡、および内視鏡用光モジュールの製造方法
Abstract:
(EN) An endoscope optical module 1 is provided with: an optical fiber 10; an optical element 20; a first substrate 30, which has an insertion hole H30 having the optical fiber 10 inserted therein, said insertion hole being formed in a first main surface 30SA, and which has an optical element 20 that is mounted on a second main surface 30SB; a second substrate 40 having a recessed section H40 in a third main surface 40SA, said recessed section having the optical element 20 housed therein; and a solder ring 50 that connects an annular seal ring 33 on the second main surface 30SB of the first substrate 30, and an annular guard ring 43 on the third main surface 40SA of the second substrate 40 to each other. The outer size of the first substrate 30 and that of the second substrate 40 are same in the direction in which the optical axis is orthogonal to the substrates, and each of the side surfaces of the first substrate and each of the side surfaces of the second substrate are within a same plane.
(FR) Un module optique d'endoscope 1 est pourvu : d'une fibre optique 10; d'un élément optique 20; d'un premier substrat 30, qui a un trou d'insertion H30 à l'intérieur duquel la fibre optique 10 est logée, ledit trou d'insertion étant formé dans une première surface principale 30SA, et qui a un élément optique 20 qui est monté sur une seconde surface principale 30SB; un second substrat 40 ayant une section évidée H40 dans une troisième surface principale 40SA, l'élément optique 20 étant logé à l'intérieur de ladite section évidée; et une bague de soudure 50 qui relie une bague d'étanchéité annulaire 33 sur la seconde surface principale 30SB du premier substrat 30 à une bague de protection annulaire 43 sur la troisième surface principale 40SA du second substrat 40. La taille externe du premier substrat 30 et celle du second substrat 40 sont identiques dans la direction dans laquelle l'axe optique est orthogonal aux substrats, et chacune des surfaces latérales du premier substrat et chacune des surfaces latérales du second substrat sont dans un même plan.
(JA) 内視鏡用光モジュール1は、光ファイバ10と、光素子20と、第1の主面30SAに光ファイバ10が挿入されている挿入孔H30を有し第2の主面30SBに光素子20が実装されている第1基板30と、第3の主面40SAに光素子20が収容されている凹部H40がある第2基板40と、第1基板30の第2の主面30SBの環状のシールリング33と、第2基板40の第3の主面40SAの環状のガードリング43とを接合している半田リング50と、を具備し、第1基板30および第2基板40が、光軸直交方向の外寸が同じで、かつ、それぞれの側面が同じ平面内にある。
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)