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1. (WO2018037497) EPOXY RESIN COMPOSITION, POTTING MATERIAL, AND POTTING MATERIAL FOR HOLLOW-FIBER MEMBRANE MODULE

Pub. No.:    WO/2018/037497    International Application No.:    PCT/JP2016/074634
Publication Date: Fri Mar 02 00:59:59 CET 2018 International Filing Date: Thu Aug 25 01:59:59 CEST 2016
IPC: C08L 63/00
C08G 59/50
Applicants: SEKISUI FULLER COMPANY, LTD.
積水フーラー株式会社
Inventors: SHIMAMURA, Kazuyori
嶋村 和頼
WATANABE, Ichiro
渡辺 一郎
Title: EPOXY RESIN COMPOSITION, POTTING MATERIAL, AND POTTING MATERIAL FOR HOLLOW-FIBER MEMBRANE MODULE
Abstract:
The present invention provides an epoxy resin composition which cures at low temperatures, is inhibited from generating heat during curing, has excellent flowability, and can give cured objects having excellent mechanical strength. The epoxy resin composition of the present invention is characterized by comprising: a main ingredient which comprises 100 parts by mass of a liquid epoxy resin and 2-120 parts by mass of a (meth)acryloyl-containing compound having an acryloyl equivalent of 350 or less; and a polyfunctional amine hardener which has amino groups bonded to secondary carbon atoms and which has a total amine value of 60 or higher.