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1. (WO2018037434) CIRCUIT SUBSTRATE MANUFACTURING METHOD

Pub. No.:    WO/2018/037434    International Application No.:    PCT/JP2016/003854
Publication Date: Fri Mar 02 00:59:59 CET 2018 International Filing Date: Thu Aug 25 01:59:59 CEST 2016
IPC: H05K 3/46
Applicants: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
パナソニックIPマネジメント株式会社
Inventors: TASIRO, Yutaka
田代 浩
KOMORI, Kiyotaka
古森 清孝
Title: CIRCUIT SUBSTRATE MANUFACTURING METHOD
Abstract:
A circuit substrate manufacturing method comprises a core substrate preparing step, a first molding step, and a second molding step. The core substrate preparing step includes preparing a core substrate comprising an insulation layer containing a thermoplastic resin, a first circuit formed on one surface of the insulation layer, and a planar metal layer bonded to the other surface of the insulation layer. The first molding step includes arranging and integrally laminating, in this order, a first adhesive layer, including a resin component with a softening point lower than the softening point of the thermoplastic resin, and a first metal foil, on a first surface on which the first circuit of the core substrate has been arranged. The second molding step includes patterning the metal layer on the laminated body obtained in the first molding step, to form a second circuit on a second surface on which said metal layer was arranged, and then arranging and integrally laminating, in this order, a second adhesive layer, including a resin component with a softening point lower than the softening point of the thermoplastic resin, and a second metal foil, on the second surface of the core substrate.