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1. (WO2018037113) METHOD FOR PRODUCING A COMPONENT MODULE, AND COMPONENT MODULE
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Pub. No.: WO/2018/037113 International Application No.: PCT/EP2017/071430
Publication Date: 01.03.2018 International Filing Date: 25.08.2017
IPC:
H01L 51/52 (2006.01)
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
51
Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof
50
specially adapted for light emission, e.g. organic light emitting diodes (OLED) or polymer light emitting devices (PLED)
52
Details of devices
Applicants:
OSRAM OLED GMBH [DE/DE]; Wernerwerkstr. 2 93049 Regensburg, DE
Inventors:
LANG, Erwin; DE
FLEISSNER, Arne; DE
WITTMANN, Sebastian; DE
WEHLUS, Thomas; DE
Agent:
EPPING HERMANN FISCHER PATENTANWALTSGESELLSCHAFT MBH; Schloßschmidstr. 5 80639 München, DE
Priority Data:
10 2016 115 902.626.08.2016DE
Title (EN) METHOD FOR PRODUCING A COMPONENT MODULE, AND COMPONENT MODULE
(FR) PROCÉDÉ DE RÉALISATION D’UN MODULE DE COMPOSANT ET MODULE DE COMPOSANT
(DE) VERFAHREN ZUR HERSTELLUNG EINES BAUELEMENTMODULS UND BAUELEMENTMODUL
Abstract:
(EN) The invention relates to a method for producing a component module (3) comprising the following steps: providing a component holder (2) having a curved upper side and of a radiation-emitting, flexible component (1); and bending and fastening the component (1) on the upper side such that the component has a curved shape. The component module (3) has: a component holder (2) having a curved upper side and a radiation-emitting component (1), which is arranged in curved form on the upper side.
(FR) La présente invention concerne un procédé de réalisation d’un module de composant (3) comprenant les étapes consistant à : fournir un support de composant (2) qui présente un côté supérieur incurvé et un composant (1) flexible émetteur de rayonnement ; recourber le composant (1) et le fixer au côté supérieur de sorte qu’il présente une forme courbe. Le module de composant (3) présente : un support de composant (2) doté d’un côté supérieur incurvé ; et un composant émetteur de rayonnement (1) qui est disposé sur le côté supérieur sous une forme incurvée.
(DE) Ein Verfahren zur Herstellung eines Bauelementmoduls (3) umfasst folgende Schritte: -Bereitstellen eines Bauelementhalters (2) mit einer gekrümmten Oberseite und eines strahlungsemittierenden, biegbaren Bauelements (1), -Biegen und Befestigen des Bauelements (1) auf der Oberseite, sodass es eine gekrümmte Form hat. Das Bauelementmodul (3) weist auf: -einen Bauelementhalter (2) mit einer gekrümmte Oberseite und -ein strahlungsemittierendes Bauelement (1), das in gekrümmter Form auf der Oberseite angeordnet ist.
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: German (DE)
Filing Language: German (DE)