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1. (WO2018037071) A METHOD FOR MAKING THREE DIMENSIONAL STRUCTURES USING PHOTOLITHOGRAPHY AND AN ADHESIVELY BONDABLE MATERIAL
Latest bibliographic data on file with the International Bureau    Submit observation

Pub. No.: WO/2018/037071 International Application No.: PCT/EP2017/071313
Publication Date: 01.03.2018 International Filing Date: 24.08.2017
IPC:
C09J 5/00 (2006.01) ,B81C 3/00 (2006.01) ,C08G 59/40 (2006.01) ,C09D 163/00 (2006.01) ,C08G 75/045 (2016.01) ,G03F 7/038 (2006.01)
C CHEMISTRY; METALLURGY
09
DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
J
ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
5
Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
B PERFORMING OPERATIONS; TRANSPORTING
81
MICRO-STRUCTURAL TECHNOLOGY
C
PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICRO-STRUCTURAL DEVICES OR SYSTEMS
3
Assembling of devices or systems from individually processed components
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
G
MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
59
Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by reaction of epoxy polycondensates with monofunctional low-molecular-weight compounds; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
18
Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
40
characterised by the curing agents used
C CHEMISTRY; METALLURGY
09
DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
D
COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
163
Coating compositions based on epoxy resins; Coating compositions based on derivatives of epoxy resins
[IPC code unknown for C08G 75/045]
G PHYSICS
03
PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
F
PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
7
Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
004
Photosensitive materials
038
Macromolecular compounds which are rendered insoluble or differentially wettable
Applicants:
MERCENE LABS AB; Teknikringen 38 A 114 28 STOCKHOLM, SE
Inventors:
CARLBORG, Carl Fredrik; SE
HARALDSSON, Tommy; SE
MIKAELSSON, Henrik; SE
MASUDA, Noriyuki; JP
Agent:
STRÖM & GULLIKSSON AB; Box 5275 102 46 STOCKHOLM, SE
Priority Data:
1651150-325.08.2016SE
Title (EN) A METHOD FOR MAKING THREE DIMENSIONAL STRUCTURES USING PHOTOLITHOGRAPHY AND AN ADHESIVELY BONDABLE MATERIAL
(FR) PROCÉDÉ DE FABRICATION DE STRUCTURES TRIDIMENSIONNELLES UTILISANT LA PHOTOLITHOGRAPHIE ET MATÉRIAU POUVANT ÊTRE COLLÉ DE MANIÈRE ADHÉSIVE
Abstract:
(EN) A method for making three dimensional structures using photolithography and an adhesively bondable material is disclosed. A thiol-ene-epoxy (OSTE(+)) material undergoes a first reaction upon partial irradiation in a pattern to become a partially cross-linked polymer network. Non-cross-linked parts are dissolved in a solvent and removed. An initiator is added to activate the cross-linked polymer network so that it becomes adhesive and can then be covalently bound to another object to form an article. The method can be utilized to manufacture an article with a complicated three dimensional shape in an easy way.
(FR) La présente invention décrit un procédé de fabrication de structures tridimensionnelles en utilisant la photolithographie et un matériau pouvant être collé de manière adhésive. Un matériau thiol-ène-époxy (OSTE(+)) subit une première réaction à l’issue de l’exposition partielle à un rayonnement en un motif pour devenir un réseau polymère partiellement réticulé. Les parties non réticulées sont dissoutes dans un solvant et retirées. Un initiateur est ajouté pour activer le réseau polymère réticulé de sorte qu’il devienne adhésif et peut ensuite être lié de manière covalente à un autre objet pour former un article. Le procédé peut être utilisé pour fabriquer un article selon une forme tridimensionnelle compliquée d’une manière facile.
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: English (EN)
Filing Language: English (EN)