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|1. (WO2018036319) SEMICONDUCTOR PACKAGING STRUCTURE AND MANUFACTURING METHOD|
|Applicants:||GREAT TEAM BACKEND FOUNDRY (DONGGUAN), LTD.
HSU, Cheng Chieh
|Title:||SEMICONDUCTOR PACKAGING STRUCTURE AND MANUFACTURING METHOD|
Disclosed are a semiconductor packaging structure and a manufacturing method. The semiconductor packaging structure comprises a chip (1). The chip has a first surface and a second surface opposite the first surface, wherein the first surface and the second surface are both provided with an electrode. A solder paste (2) is coated on the surface of the electrode on the first surface, and a plastic packaging material (3) is coated on a position without the electrode arranged thereon on the first surface, with the outer surfaces of the solder paste and the plastic packaging material forming a packaging surface. The second surface is connected to an electrical connecting piece.