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1. (WO2018036191) PEROVSKITE THIN FILM EVAPORATION EQUIPMENT, USING METHOD THEREOF, AND APPLICATION THEREOF
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Pub. No.: WO/2018/036191 International Application No.: PCT/CN2017/082792
Publication Date: 01.03.2018 International Filing Date: 03.05.2017
IPC:
C23C 16/30 (2006.01) ,C23C 16/448 (2006.01) ,C23C 16/52 (2006.01)
C CHEMISTRY; METALLURGY
23
COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
C
COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
16
Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition (CVD) processes
22
characterised by the deposition of inorganic material, other than metallic material
30
Deposition of compounds, mixtures or solid solutions, e.g. borides, carbides, nitrides
C CHEMISTRY; METALLURGY
23
COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
C
COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
16
Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition (CVD) processes
44
characterised by the method of coating
448
characterised by the method used for generating reactive gas streams, e.g. by evaporation or sublimation of precursor materials
C CHEMISTRY; METALLURGY
23
COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
C
COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
16
Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition (CVD) processes
44
characterised by the method of coating
52
Controlling or regulating the coating process
Applicants:
杭州纤纳光电科技有限公司 HANGZHOU MICROQUANTA SEMICONDUCTOR CO., LTD [CN/CN]; 中国浙江省杭州市 余杭区五常街道文一西路998号海创园18楼 No.18 Haichuangyuan Building No.998 Wenyi West Road, Wuchang Street, Yuhang District Hangzhou, Zhejiang 311121, CN
Inventors:
姚冀众 YAO, Jizhong; CN
颜步一 YAN, Buyi; CN
Agent:
浙江一墨律师事务所 Y&M LAW FIRM ZHEJIANG; 中国浙江省杭州市 文二西路716号西溪乐谷创意产业园1号楼4楼 Block 1 No.4 Floor Xixi Joy Valley Creative Industry Park No.716 Wen'er West Road, Hangzhou, Zhejiang 310031, CN
Priority Data:
201610721602.525.08.2016CN
Title (EN) PEROVSKITE THIN FILM EVAPORATION EQUIPMENT, USING METHOD THEREOF, AND APPLICATION THEREOF
(FR) ÉQUIPEMENT D'ÉVAPORATION DE FILM MINCE DE PÉROVSKITE, SON PROCÉDÉ D'UTILISATION ET SON APPLICATION
(ZH) 一种钙钛矿薄膜的蒸发设备及其使用方法和应用
Abstract:
(EN) A perovskite thin film evaporation equipment, comprising evaporation systems (E, E1, E2) and a deposition system (F) which are separately provided. The evaporation systems (E1, E2) and the deposition system (F) are in communication with each other by means of steam channels (20, 31). The deposition system (F) comprises a deposition cavity (09). A deposition support (07) for placing substrates (06) to be deposited is provided in the deposition cavity (09). A mesh screen (05) is provided between entries of the steam channels (20, 31) of the deposition cavity (09) and the substrates (06) to be deposited. The mesh screen (05) is provided with a plurality of through holes (11) allowing steam to pass through. The steam evaporated by the evaporation systems (E1, E2) enters the deposition cavity (09) through the steam channels (20, 31) respectively, and is evenly distributed on the surfaces of the substrates (06) to be deposited after passing through the through holes (11) of the mesh screen (05). Also provided are a method of using the perovskite thin film evaporation equipment and an application of the using method.
(FR) L'invention concerne un équipement d'évaporation de film mince de pérovskite, comprenant des systèmes d'évaporation (E, E1, E2) et un système de dépôt (F) qui sont fournis séparément. Les systèmes d'évaporation (E1, E2) et le système de dépôt (F) sont en communication les uns avec les autres au moyen de canaux de vapeur (20, 31). Le système de dépôt (F) comprend une cavité de dépôt (09). Un support de dépôt (07) destiné à placer des substrats (06) à déposer est disposé dans la cavité de dépôt (09). Un tamis à mailles (05) est disposé entre les entrées des canaux de vapeur (20, 31) de la cavité de dépôt (09) et les substrats (06) à déposer. Le tamis à mailles (05) comporte une pluralité de trous traversants (11) permettant à la vapeur de passer. La vapeur évaporée par les systèmes d'évaporation (E1, E2) pénètre dans la cavité de dépôt (09) par les canaux de vapeur (20, 31) respectivement, et est répartie uniformément sur les surfaces des substrats (06) à déposer après avoir traversé les trous traversants (11) du tamis à mailles (05). L'invention concerne également un procédé d'utilisation de l'équipement d'évaporation de film mince de pérovskite et une application du procédé d'utilisation.
(ZH) 一种钙钛矿薄膜的蒸发设备,包括分开设置的蒸发系统(E,E1,E2)和沉积系统(F),蒸发系统(E1,E2)和沉积系统(F)通过蒸汽通道(20,31)相互连通,沉积系统(F)包括沉积腔体(09),在沉积腔体(09)内设置有放置待沉积基板(06)的沉积支架(07),在沉积腔体(09)的蒸汽通道(20,31)进入口与待沉积基板(06)之间设置有网筛(05),在网筛(05)上设置有多个便于蒸汽通过的通孔(11),蒸发系统(E1,E2)蒸发的蒸汽分别通过蒸汽通道(20,31)进入沉积腔体(09),并经过网筛(05)的通孔(11)后均匀地分布在待沉积基板(06)的表面上。还包括一种钙钛矿薄膜的蒸发设备的使用方法和使用方法的应用。
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Chinese (ZH)
Filing Language: Chinese (ZH)